Optimal Design of Narrow Line‐Width Front Contact Grid Pattern for Silicon Solar Cells and Low‐Cost Fabrication of Electroless Nickel Plated Imprint Lithography Hard Stamp

Herein, a systematic investigation on the design and development of a cost‐effective nickel hard stamp suitable for fabrication of a new front‐side metallization pattern to reduce the shadow losses in solar cells is demonstrated. Finite element analysis (FEA)–based simulations indicate an optimal finger width of ≈20 μm with interfinger spacing of 1000 μm which can effectively enhance solar cell efficiency by ≈1% due to reduced shadow loss. The optimal grid design is further patterned by means of nanoimprint lithography (NIL) followed by an electroless deposition method. A cost‐effective, electroless deposited nickel hard template is developed for NIL patterning using UV pattern transfer. To avoid the physical damages during the imprinting process and improve the durability of the NIL stamp, silane‐based antiadhesive coating is used which can withstand up to 18 cycles of imprinting process. The nickel hard stamp exhibits improved hardness of 5.63 GPa and roughness of 8 nm and is used to transfer the narrow‐line width patterns during the imprinting process. The proposed industry‐ready technology overcomes the limitations of the existing screen printing process pertaining to the formation of high‐aspect‐ratio narrow line‐width finger grid patterns.