Investigation of the Effect of the Thermo‐Mechanical Processing of Additively Manufactured CoCrFeNiAl_{0.4} High‐Entropy Alloy

Qiang Li; Xizhang Chen; Jian Zhang; Subramanian Jayalakshmi; Ramachandra Arvind Singh

doi:10.1002/adem.202101628

journal article·2022-09

Investigation of the Effect of the Thermo‐Mechanical Processing of Additively Manufactured CoCrFeNiAl_0.4 High‐Entropy Alloy

Qiang Li, Xizhang Chen, Jian Zhang, Subramanian Jayalakshmi, Ramachandra Arvind Singh

Advanced Engineering Materials· Volume 24· Issue 9

Publisher page

Source abstract

Abstract

Thermomechanical processing (TMP) is a significant route to tune the microstructure and mechanical properties of high‐entropy alloy (HEA), which employs plastic deformation and heat treatment. Herein, bulk CoCrFeNiAl_0.4 high‐entropy alloy has been fabricated by powder plasma arc additive manufacturing (PPA‐AM), which was subjected to TMP including different extents of plastic deformations and followed by annealing. The evolution of microstructure and mechanical properties of the HEAs during TMP is studied, and the contribution of strengthening mechanisms to the improvement of mechanical properties is quantified. By increasing the plastic deformation of TMP, the hardness and yield strength of the alloys increase by 94% and 105%, respectively, and are accompanied by a strain of 29.1%. Based on analysis and calculations, it is found that grain boundary strengthening significantly contributes to the improved performance of bulk CoCrFeNiAl_0.4 HEA fabricated by PPA‐AM + TMP. PPA‐AM + TMP synthesis is an innovative way to prepare bulk HEAs with a refined microstructure and better mechanical properties.

Source: crossref · Quality: baseline

Research context

Metals & alloys Materials processing

OpenAlex topics: High Entropy Alloys Studies · High-Temperature Coating Behaviors · Additive Manufacturing Materials and Processes

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Mechanical and Electrical Engineering Wenzhou University Wenzhou Zhejiang 325035 China

Funding

National Natural Science Foundation of China

References (60)

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