Electroplating of Aerosol Jet‐Printed Silver Inks
Source abstract
Abstract
Aerosol jet printing of silver inks is a promising approach for 3D printing of electronics, particularly for obtaining very complex circuits with high‐resolution conductive pads and traces. Common silver inks are however not competitive with traditional bulk metal conductors, requiring sintering at high temperatures as well as having significant porosity that can result in early failure. Herein, the possibility of using electroplating to deposit bulk metal copper on aerosol jetted inks is investigated, and more than an order of magnitude reduction in electrical resistivity is shown. The plating rate, resistivity, and adhesion are characterized, along with the morphology of the resulting deposits. This approach is then shown to allow high‐strength soldering to the electroplated metal traces, demonstrating the capability of this technology for integration of soldered surface mount components with aerosol jet‐printed electronics.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Nanomaterials and Printing Technologies · Advanced Sensor and Energy Harvesting Materials · Additive Manufacturing and 3D Printing Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Research and Exploratory Development Department Johns Hopkins Applied Physics Laboratory Laurel MD 20723 USA
Sensors and Electron Devices Directorate Army Research Lab Adelphi MD 20783 USA
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