journal article·2009-04

New Materials in Memory Development Sub 50 nm: Trends in Flash and DRAM

Karl Heinz Kuesters, Marc Florian Beug, Uwe Schroeder, Nicolas Nagel, Ulrike Bewersdorff, Gerald Dallmann, Stefan Jakschik, Roman Knoefler, Stephan Kudelka, Christoph Ludwig, Dirk Manger, Wolfgang Mueller, Armin Tilke

Advanced Engineering Materials· Volume 11· Issue 4
Publisher page

Abstract

Abstract New materials are of key importance for scaling memories in the sub 50 nm generations. Currently high‐k materials and metal gates are investigated for usage in Flash and DRAM memory. However, the requirements in the applications are different, leading to different material combinations. This paper gives an overview on new materials with focus on memory applications.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Semiconductor materials and devices · Advanced Memory and Neural Computing · Ferroelectric and Negative Capacitance Devices

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (38)

Show source-provided references
1. ITRS roadmap see:http://www.itrs.net/.
2. 10.1038/nprot.2007.53510.1038/nprot.2007.535 ↗
3. 10.1109/IEDM.2004.141931910.1109/IEDM.2004.1419319 ↗
4. 10.1109/.2006.162947410.1109/.2006.1629474 ↗
5. Shin Y. · IEDM Tech. Dig. · 2005 · 13 · 337
6. Park Y. · IEDM Tech. Dig. · 2006 · 29
7. Specht M. · ESSDERC · 2003 · 155
8. 10.1063/1.134389210.1063/1.1343892 ↗
9. Mikolajick T. · Proceedings VLSI‐TSA · 2007 · 130
10. Mueller W. · IEDM Tech. Dig. · 2006 · 14.1
11. 10.1109/55.87720510.1109/55.877205 ↗
12. Lee C. H. · Appl. Phys. Lett. · 2005 · 86 · 152908‐1
13. Lee C. H. · VLSI Symposium Tech. Dig. · 2006 · 3.4
14. Breuil L. · Proceedings ICMTD‐NVSMW · 2008 · 126
15. Melde T. · Proceedings ICMTD‐NVSMW · 2008 · 130
16. Furnemont A. · Proceedings ICMTD · 2007 · 205
17. Lue H. T. · VLSI Symposium Tech. Dig. · 2008 · 116
18. Schroeder U. · Freiberger Silicium Days · 2007
19. Kil D. S. · VLSI Symposium Tech.Dig. · 2004 · 73
20. Schroeder U. · DPG Spring Meeting · 2008
21. 10.1109/IEDM.2004.141906810.1109/IEDM.2004.1419068 ↗
22. Kil D. S. · VLSI Symposium Tech. Dig. · 2006 · 73
23. 10.1063/1.152282610.1063/1.1522826 ↗
24. Cho C. · VLSI Symposium Tech. Dig · 2005 · 36
25. Weinreich W. · AVS‐ALD Conference · 2008
26. 10.1088/0022-3727/41/17/17200510.1088/0022-3727/41/17/172005 ↗
27. 10.1016/j.mee.2008.03.02010.1016/j.mee.2008.03.020 ↗
28. 10.1016/j.sse.2004.11.01110.1016/j.sse.2004.11.011 ↗
29. 10.1002/adma.20089006710.1002/adma.200890067 ↗
30. 10.1109/LED.2004.82857010.1109/LED.2004.828570 ↗
31. Tateshita Y. · IEDM Tech. Dig. · 2006 · 63
32. Harris H. R. · VLSI Symposium Tech. Dig. · 2007 · 154
33. Chudzik M. · VLSI Symposium Tech. Dig. · 2007 · 194
34. Hyun S. · VLSI Symposium Tech. Dig. · 2007 · 184
35. Sivasubramani P. · VLSI Symposium Tech. Dig. · 2007 · 68
36. 10.1109/VLSIT.2008.458856410.1109/VLSIT.2008.4588564 ↗
37. Kubicek S. · IEDM Tech. Dig. · 2007 · 49
38. G.Jinet al. 2nd International Workshop on Nanoscale Semiconductor Devices 2005.