Localized Electrochemical Deposition 3D Copper–Nickel Core‐Shell Structures at Meso‐Scale

Localized electrochemical deposition (LECD) is a novel technique for the fabrication of metal microstructures, which enables the precise deposition of metal structures at designated locations. Currently, copper constitutes the majority of deposited metal microstructures owing to its high electrical conductivity, low cost, and favorable fatigue resistance. However, copper exhibits several drawbacks such as susceptibility to oxidation, poor corrosion resistance, low hardness, and inadequate mechanical strength. To overcome these limitations, a copper–nickel core‐shell reinforcement structure is developed, resulting in a significant enhancement of the mechanical properties of the original metal structure. Copper core structures are fabricated using the LECD method, and the effects of deposition potential and electrolyte concentration on the deposition rate are examined. The influence of deposition potential and deposition time on the formation of the nickel shell layer is determined, and the deposited nickel shell layer significantly reduces the defects generated during the deposition of the copper core structure. After conformal deposition, the Cu–Ni core‐shell structure significantly enhances the mechanical properties of the copper. Compared with the pure copper structure, the mechanical properties are improved by 124%, indicating a significant strengthening effect, while the adaptability to actual environments has also been enhanced. This enhancement broadens the potential applications in areas such as electronics, energy, environmental science, and catalysis.