Shape Synergy of Ag@Cu Chip Packaging Nano‐Paste and Its Sintering Reliability
Source abstract
Abstract
Electrochemical migration of Ag can result in failure of power chips, thus affecting the application of nano‐Ag paste as packaging material. In this study, a novel sintered material is developed using shape‐synergistic Ag‐coated Cu (Ag@Cu) particles, aiming at establishing a highly reliable connection between the chips and the substrates. The sintering behavior of Ag@Cu particles is examined, elucidating the role of skeleton‐wetting synergism in enhancing the strength of the sintered layer from a structural perspective. Two distinct shapes of Ag@Cu particles serve as a skeleton support, providing electrical conductivity, and nano‐Ag particles enhance wettability. Ag as a coating layer can slow down the oxidation of Cu, despite that oxidation still occurs in the sintered layer during the high‐temperature tests, initially weakening the strength of the sintered layer, but eventually stabilization is achieved. The presence of Cu effectively inhibits electrochemical migration of Ag. The reliability of the sintered layer is enhanced by the novel shape of Ag@Cu particles and the interaction between Ag and Cu, thereby ensuring the stability of the power chips.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Nanomaterials and Printing Technologies · Advanced Sensor and Energy Harvesting Materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Mechanical Engineering and Automation Beihang University Beijing 100191 China
Institute of Materials Science and Engineering Technical University of Chemnitz 09111 Chemnitz Germany
Department of Mechanical Engineering Tsinghua University Beijing 100084 China
Faculty of Materials and Manufacturing Beijing University of Technology Beijing 100124 China
Funding
Beijing Natural Science Foundation · Jiangxi Provincial Natural Science Foundation · Aeronautical Science Foundation of China
References (68)
Show source-provided references
1. 10.1016/j.pquantelec.2022.10039710.1016/j.pquantelec.2022.100397 ↗
2. 10.1016/j.applthermaleng.2022.11845810.1016/j.applthermaleng.2022.118458 ↗
3. 10.1016/j.fmre.2021.11.00210.1016/j.fmre.2021.11.002 ↗
4. 10.1016/j.matlet.2021.13013710.1016/j.matlet.2021.130137 ↗
5. 10.1016/j.intermet.2024.10825210.1016/j.intermet.2024.108252 ↗
6. 10.1016/j.microrel.2009.10.00410.1016/j.microrel.2009.10.004 ↗
7. 10.1016/j.microrel.2013.07.08810.1016/j.microrel.2013.07.088 ↗
8. 10.1016/j.microrel.2016.06.01410.1016/j.microrel.2016.06.014 ↗
9. 10.1016/j.engfailanal.2022.10698610.1016/j.engfailanal.2022.106986 ↗
10. 10.1016/j.chip.2023.10004810.1016/j.chip.2023.100048 ↗
11. 10.1016/j.tsf.2023.13982710.1016/j.tsf.2023.139827 ↗
12. 10.1016/j.corsci.2024.11211210.1016/j.corsci.2024.112112 ↗
13. 10.1016/j.apmt.2024.10239710.1016/j.apmt.2024.102397 ↗
14. J. X.Liu Y.Mou Y.Peng M. X.Chen in2020 IEEE 70th Electronic Components and Technology Conf. Florida USA2020.
15. 10.1016/j.rineng.2023.10134710.1016/j.rineng.2023.101347 ↗
16. Liu W. · IEEE Trans. Comput. · 2017 · 7 · 1050
17. 10.1021/acs.jpcc.7b0958110.1021/acs.jpcc.7b09581 ↗
18. 10.1016/j.matlet.2014.04.12710.1016/j.matlet.2014.04.127 ↗
19. 10.1016/j.jallcom.2018.10.06710.1016/j.jallcom.2018.10.067 ↗
20. 10.1016/j.jallcom.2020.15517310.1016/j.jallcom.2020.155173 ↗
21. 10.1038/s41560-023-01245-410.1038/s41560-023-01245-4 ↗
22. 10.1016/j.surfin.2020.10059810.1016/j.surfin.2020.100598 ↗
23. W.Lin Y.Zhang G. N.Yang C. Q.Cui in2020 IEEE 21th Int. Conf. on Electronics Packaging Technology Guangzhou China2020.
24. 10.1016/j.jallcom.2021.15872610.1016/j.jallcom.2021.158726 ↗
25. 10.1016/j.surfin.2024.10417310.1016/j.surfin.2024.104173 ↗
26. 10.1016/j.corsci.2022.11071310.1016/j.corsci.2022.110713 ↗
27. 10.1016/j.actamat.2022.11813510.1016/j.actamat.2022.118135 ↗
28. 10.1016/j.jmst.2022.08.03110.1016/j.jmst.2022.08.031 ↗
29. 10.1021/acsami.8b0299610.1021/acsami.8b02996 ↗
30. 10.1016/j.microrel.2022.11479610.1016/j.microrel.2022.114796 ↗
31. 10.1016/j.engfailanal.2020.10512810.1016/j.engfailanal.2020.105128 ↗
32. 10.1016/j.electacta.2023.14338810.1016/j.electacta.2023.143388 ↗
33. 10.1016/j.jmrt.2023.11.04210.1016/j.jmrt.2023.11.042 ↗
34. 10.1016/j.isci.2023.10831810.1016/j.isci.2023.108318 ↗
35. 10.1016/j.matdes.2016.11.07410.1016/j.matdes.2016.11.074 ↗
36. 10.1016/j.jallcom.2019.06.11910.1016/j.jallcom.2019.06.119 ↗
37. 10.1016/j.corsci.2011.06.01510.1016/j.corsci.2011.06.015 ↗
38. 10.1016/j.jallcom.2016.07.20710.1016/j.jallcom.2016.07.207 ↗
39. 10.1007/s00542-008-0643-y10.1007/s00542-008-0643-y ↗
40. Y.Zhou P.Yang C.Yuan Y.Huo inIEEE 12th Prognostics and Health Management Maryland USA2013.
41. 10.1016/j.corsci.2024.11207610.1016/j.corsci.2024.112076 ↗
42. 10.1016/j.ijthermalsci.2014.08.02210.1016/j.ijthermalsci.2014.08.022 ↗
43. 10.1016/j.rinp.2024.10741110.1016/j.rinp.2024.107411 ↗
44. 10.1016/j.jmrt.2024.05.19610.1016/j.jmrt.2024.05.196 ↗
45. L.Li Y.Liu J.Zhang Z.Pan N.Xiao in2022 IEEE 23th Int. Conf. on Electronics Packaging Technology Liaoning China2022.
46. 10.1021/acsami.9b2073110.1021/acsami.9b20731 ↗
47. 10.1021/acsomega.3c0285410.1021/acsomega.3c02854 ↗
48. Q.Gao W.Zhou Z. H.Ji X. B.Wang Z. D.Xia F.Guo in2022 IEEE 23th Int. Conf. on Electronics Packaging Technology Liaoning China2022.
49. Lv W. S. · IEEE Trans. Electron. Devices · 2023 · 70 · 6
50. C. H.Tsai F.Steiner D.Ishikawa C. R.Kao T.Blank in2023 IEEE 24th Int. Conf. on Electronics Packaging Technology Xinjiang China2023.
51. 10.1021/acsaelm.1c0025810.1021/acsaelm.1c00258 ↗
52. 10.1021/acsaelm.3c0050910.1021/acsaelm.3c00509 ↗
53. Zhang H. Z. · IEEE Trans. Compon., Packag., Manuf. Technol. · 2023 · 13 · 6
54. 10.1016/j.jallcom.2016.08.06010.1016/j.jallcom.2016.08.060 ↗
55. 10.1016/j.matchar.2024.11369610.1016/j.matchar.2024.113696 ↗
56. 10.1016/j.ijadhadh.2019.10248810.1016/j.ijadhadh.2019.102488 ↗
57. 10.1021/acsaelm.2c0037610.1021/acsaelm.2c00376 ↗
58. 10.1007/s10854-010-0198-410.1007/s10854-010-0198-4 ↗
59. 10.1016/j.ceramint.2020.07.02810.1016/j.ceramint.2020.07.028 ↗
60. 10.1016/j.jmrt.2020.11.06910.1016/j.jmrt.2020.11.069 ↗
61. 10.1016/j.matchar.2023.11317510.1016/j.matchar.2023.113175 ↗
62. 10.1016/j.microrel.2021.11403510.1016/j.microrel.2021.114035 ↗
63. 10.1016/j.corcom.2022.09.00410.1016/j.corcom.2022.09.004 ↗
64. 10.1007/s10854-017-7085-110.1007/s10854-017-7085-1 ↗
65. H.Gong Y.Yao J. D.Wang S. B.Wang X.Long in2018 IEEE 19th Int. Conf. on Electronics Packaging Technology Shanghai China2018.
66. B. H.Lee M. Z.Ng A. A.Zinn C. L.Gan in2015 IEEE 17th Int. Conf. on Electronics Packaging Technology Hubei China2015.
67. 10.1007/s10853-023-08702-110.1007/s10853-023-08702-1 ↗
68. 10.1016/j.jallcom.2016.06.13210.1016/j.jallcom.2016.06.132 ↗