journal article·2024-11Open access

Stretchable Conductive Inks with Carbon‐Based Fillers for Conformable Printed Electronics

Lia Campos‐Arias, Nikola Peřinka, Pedro Costa, José Luis Vilas‐Vilela, Senentxu Lanceros‐Méndez

Advanced Engineering Materials· Volume 26· Issue 21

Abstract

With the constant increase of electronic waste globally, society is demanding and governments are boosting the development of electronics with less pollutant materials and reduced environmental impact. One way to achieve this is to implement materials that are functional and structural at the same time, reducing material use and assembling parts. Further, printing techniques, such as screen printing, reduce considerably costs and time compared with conventional electronics; combined with methods to conform printed electronics to a 3D shape, such as thermoforming, allow to obtain nonplanar surface electronics simply and efficiently. Herein, screen‐printable inks made of styrene–ethylene/butylene–styrene and different aspect‐ratio carbon‐based materials for conformable electronics are reported. The inks are prepared with carbon black, carbon nanotubes, and reduced graphene oxide as conductive fillers, printed on a flexible substrate and thermoformed. Carbon black and carbon nanotube samples are functional after the process, with conductivities of 96 and 141 S m −1 for the best performing sample of each filler, respectively. Rheological, morphological, thermal, and electrical properties of the materials are also characterized. This study shows the influence of the filler's type and aspect ratio on the morphology and electrical conductivity of the printed materials before and after thermoforming.
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Research context

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Supercapacitor Materials and Fabrication · Conducting polymers and applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

BCMaterials, Basque Center for Materials, Applications and Nanostructures UPV/EHU Science Park 48940 Leioa Spain

Grupo de Química Macromolecular (LABQUIMAC) Dpto. Química‐Física, Facultad de Ciencia y Tecnología Universidad del País Vasco (UPV/EHU) 48940 Leioa Bizkaia Spain

Physics Centre of Minho and Porto, Universities (CF‐UM‐UP) and LaPMET ‐ Laboratory of Physics for Materials and Emergent Technologies University of Minho 4710‐057 Braga Portugal

IKERBASQUE Basque Foundation for Science 48009 Bilbao Spain

Funding

Euskal Herriko Unibertsitatea · Ekonomiaren Garapen eta Lehiakortasun Saila, Eusko Jaurlaritza · Directorate-General for Research and Innovation · Eusko Jaurlaritza · Fundação para a Ciência e a Tecnologia

References (37)

Show source-provided references
1. 10.1016/j.orgel.2020.10588110.1016/j.orgel.2020.105881 ↗
2. 10.1016/j.jmst.2022.10.04710.1016/j.jmst.2022.10.047 ↗
3. Forti V. · 2020
4. T.Loher M.Seckel J.Haberland J.Marques M.von Krshiwoblozki C.Kallmayer A.Ostmann in2019 IEEE CPMT Symp. Japan (ICSJ) IEEE Kyoto2019 pp.113–117.10.1109/ICSJ47124.2019.8998743 ↗
5. 10.1016/j.polymer.2022.12480410.1016/j.polymer.2022.124804 ↗
6. 10.1002/adma.20100469210.1002/adma.201004692 ↗
7. 10.1038/s41528-023-00242-710.1038/s41528-023-00242-7 ↗
8. 10.1016/j.indcrop.2023.11684210.1016/j.indcrop.2023.116842 ↗
9. 10.1038/s41528-023-00258-z10.1038/s41528-023-00258-z ↗
10. 10.1016/j.mtsust.2022.10029210.1016/j.mtsust.2022.100292 ↗
11. 10.1002/adfm.20221374410.1002/adfm.202213744 ↗
12. 10.1016/j.orgel.2022.10661210.1016/j.orgel.2022.106612 ↗
13. 10.1016/j.sna.2022.11382110.1016/j.sna.2022.113821 ↗
14. 10.1016/j.jechem.2021.08.01110.1016/j.jechem.2021.08.011 ↗
15. 10.1016/j.icheatmasstransfer.2010.01.00510.1016/j.icheatmasstransfer.2010.01.005 ↗
16. 10.1002/pen.2591810.1002/pen.25918 ↗
17. P.Lall V.Soni H.Jang F.Musa M. G.Sarwar S.Miller in2024 IEEE 74th Electron. Comp. Technol. Conf. (ECTC) Denver2024 pp.1198–1205.10.1109/ECTC51529.2024.00193 ↗
18. 10.1002/adem.20220073010.1002/adem.202200730 ↗
19. C.Kallmayer F.Schaller T.Loher J.Haberland F.Kayatz A.Schult in2018 IEEE 13th Int. Congress Mold. Interconnect Dev. (MID) IEEE Würzburg2018 pp.1–6.10.1109/ICMID.2018.8526929 ↗
20. 10.1007/s00170-020-05377-910.1007/s00170-020-05377-9 ↗
21. 10.1088/2058-8585/acdfe010.1088/2058-8585/acdfe0 ↗
22. O.Rusanen T.Simula P.Niskala V.Lindholm M.Heikkinen in2019 IEEE 22nd Eur. Microelectron. Packaging Conf. Exhib. (EMPC) IEEE Pisa2019 pp.1–7.
23. A.Wimmer H.Reichel K.Schmidt in2018 IEEE 13th Int. Congress Mold. Interconnect Dev. (MID) IEEE Würzburg2018 pp.1–5.
24. 10.1088/2058-8585/acd12910.1088/2058-8585/acd129 ↗
25. 10.1021/acsapm.3c0115110.1021/acsapm.3c01151 ↗
26. 10.3390/coatings1309154810.3390/coatings13091548 ↗
27. 10.1186/s40510-021-00362-810.1186/s40510-021-00362-8 ↗
28. GTeek PETG Sheets Data https://www.gteek.com/PETG‐sheets accessed: July 2024.
29. 10.3390/mi1310165510.3390/mi13101655 ↗
30. 10.1016/j.carbpol.2020.11585510.1016/j.carbpol.2020.115855 ↗
31. 10.1016/B978-0-323-52472-8.00009-510.1016/B978-0-323-52472-8.00009-5 ↗
32. 10.1016/j.eurpolymj.2019.10922610.1016/j.eurpolymj.2019.109226 ↗
33. 10.1016/j.compositesb.2015.09.00110.1016/j.compositesb.2015.09.001 ↗
34. 10.1016/j.compositesa.2013.01.00410.1016/j.compositesa.2013.01.004 ↗
35. 10.1103/PhysRevLett.59.130510.1103/PhysRevLett.59.1305 ↗
36. M.Gill A.Gruner N.Ghalib M.Sussman S.Avuthu G.Wable J.Richstein inIPC APEX EXPO Proc. IPC St. Petersburg FL2018.
37. 10.1002/aelm.20210019410.1002/aelm.202100194 ↗