journal article·2025-02

A Review of Electroplastic Effect on Difficult‐to‐Machine Materials in Cutting Processing

Xiaoyu Dong, Yanan Pan, Jitao Fang, Yongzhi Pan, Jichang Gao, Xiuli Fu

Advanced Engineering Materials· Volume 27· Issue 4
Publisher page

Abstract

Electroplastic effect refers to the role of pulsed current, material plasticity, and microstructural properties change, resulting in an increase in the plasticity of the material, the deformation resistance is reduced, and thus improves the processing performance of the phenomenon. This article summarizes the Joule thermal effect and a variety of nonthermal effects of the electrophysical effect mechanism, of which the nonthermal effects include pure electrophysical effect, magnetic field compression effect, and skin effect. The application of electroplastic‐assisted technology in cutting machining, such as turning, milling, drilling, and so on, and the potential application in other manufacturing processes are summarized. The limitations and shortcomings of the electroplastic‐assisted technology are analyzed, including the limitations of the required special equipment, machining platforms, and electric pulse parameters. The effects of different electric pulse parameters on the machinability of various types of difficult‐to‐machine metallic materials are summarized. The electric pulse parameters within a certain threshold range can promote the dynamic recrystallization of the workpiece, enhance the plastic deformation of the cutting zone, reduce the cutting force, improve the surface finish, and reduce tool wear. Finally, this article summarizes and looks forward to the electroplastic‐assisted cutting technology.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Electromagnetic Effects on Materials

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Mechanical Engineering University of Jinan Jinan 250022 China

Funding

National Natural Science Foundation of China

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