journal article·2023-02

Metal Droplet Deposition: From Foundation to Engineering Manufacturing

Hao Yi, Zhipeng Wang, Huajun Cao, Menglin Liu, Jinxin Li

Advanced Engineering Materials· Volume 25· Issue 3
Publisher page

Abstract

Metal droplet deposition is of fundamental importance in many industrial and manufacturing processes. An in‐depth understanding of the fundamental issues of metal droplet deposition is particularly crucial for developing droplet deposition‐based engineering manufacturing technologies. This review systematically introduces the evolution of metal droplet deposition stages and characteristic behaviors in terms of metal droplet deposition dynamics. The characteristic morphologies of single‐metal droplets after solidification, that is, gas entrapment, ripples, bulging edges, and splashing, are reviewed. The formation mechanisms and influencing factors of different droplet morphologies are summarized. Moreover, the deposition strategy of multiple metal droplets to promote good interfacial bonding is further concluded. Based on these theoretical foundations, three typical engineering manufacturing techniques based on metal droplet deposition, that is, thermal spraying, soldering, and droplet‐based 3D printing, are presented to elucidate further the advantages and potential of metal droplet deposition applied to engineering manufacturing. Finally, some existing problems and future research perspectives are discussed.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Fluid Dynamics and Heat Transfer · Electrohydrodynamics and Fluid Dynamics · Catalytic Processes in Materials Science

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

State Key Laboratory of Mechanical Transmission Chongqing University Chongqing 400044 China

College of Mechanical and Vehicle Engineering Chongqing University Chongqing 400044 China

Chongqing Key Laboratory of Metal Additive Manufacturing (3D Printing) Chongqing University Chongqing 400044 China

Funding

National Natural Science Foundation of China · Central University Basic Research Fund of China

References (100+)

Show source-provided references
1. 10.1146/annurev-fluid-022321-11400110.1146/annurev-fluid-022321-114001 ↗
2. 10.1088/0034-4885/71/3/03660110.1088/0034-4885/71/3/036601 ↗
3. 10.1016/j.colsurfa.2022.12917810.1016/j.colsurfa.2022.129178 ↗
4. 10.1016/j.ijheatmasstransfer.2016.05.06210.1016/j.ijheatmasstransfer.2016.05.062 ↗
5. 10.1146/annurev.fluid.38.050304.09214410.1146/annurev.fluid.38.050304.092144 ↗
6. 10.1146/annurev-fluid-122414-03440110.1146/annurev-fluid-122414-034401 ↗
7. 10.1146/annurev.matsci.38.060407.13244810.1146/annurev.matsci.38.060407.132448 ↗
8. 10.1098/rspl.1876.004810.1098/rspl.1876.0048 ↗
9. A. M.Worthington Supplementary Chapter Nabu Press1963 https://www.abe.pl/en/book/9781248756911/a-study-of-splashes.
10. 10.1063/1.152704410.1063/1.1527044 ↗
11. 10.1103/PhysRevLett.109.20450110.1103/PhysRevLett.109.204501 ↗
12. 10.1063/1.494040410.1063/1.4940404 ↗
13. 10.3390/electronics1013156810.3390/electronics10131568 ↗
14. 10.1016/0017-9310(96)00107-X10.1016/0017-9310(96)00107-X ↗
15. 10.1016/j.ijmachtools.2018.03.00610.1016/j.ijmachtools.2018.03.006 ↗
16. Gilani N. · Addit. Manuf. · 2022 · 55 · 102827
17. 10.1016/S0017-9310(99)00350-610.1016/S0017-9310(99)00350-6 ↗
18. 10.1115/1.173777810.1115/1.1737778 ↗
19. 10.1016/j.ijheatfluidflow.2004.08.00410.1016/j.ijheatfluidflow.2004.08.004 ↗
20. J. G.Mcinerney C.Gallagher G.Farrell P. J.Hughes P.Tassie D. M.Denieffe L. P.Barry K.Rodgers J.Barton H. S.Gamble P. J.Hughes J.Justice D. P.Casey A.Moore inOpto-Ireland 2005: Optoelectronics Photonic Devices and Optical Networks SPIE-INT SOC Optical Engineering2005 https://doi.org/10.1117/12.605679.10.1117/12.605679 ↗
21. 10.1108/1355254081084155310.1108/13552540810841553 ↗
22. 10.1016/j.jallcom.2020.15714010.1016/j.jallcom.2020.157140 ↗
23. 10.1063/1.86943410.1063/1.869434 ↗
24. 10.1115/1.128758710.1115/1.1287587 ↗
25. 10.1016/j.jmatprotec.2012.05.00710.1016/j.jmatprotec.2012.05.007 ↗
26. 10.1063/1.149201910.1063/1.1492019 ↗
27. 10.1109/TCAPT.2002.80678610.1109/TCAPT.2002.806786 ↗
28. 10.1016/j.ijheatmasstransfer.2005.05.04410.1016/j.ijheatmasstransfer.2005.05.044 ↗
29. 10.1063/1.177355110.1063/1.1773551 ↗
30. 10.1016/j.jmatprotec.2016.12.03110.1016/j.jmatprotec.2016.12.031 ↗
31. 10.1007/s00339-014-8735-210.1007/s00339-014-8735-2 ↗
32. 10.1088/0022-3727/38/19/01510.1088/0022-3727/38/19/015 ↗
33. 10.1002/aic.1012310.1002/aic.10123 ↗
34. 10.1098/rspa.1991.000210.1098/rspa.1991.0002 ↗
35. 10.1016/j.ijheatmasstransfer.2018.04.05610.1016/j.ijheatmasstransfer.2018.04.056 ↗
36. 10.1016/j.surfcoat.2019.12497210.1016/j.surfcoat.2019.124972 ↗
37. 10.1039/C9SM00895K10.1039/C9SM00895K ↗
38. P. Y.Wang H. J.Li L. H.Qi H. L.Deng H. S.Zuo in2nd Int. Conf. on Advanced Engineering Materials and Technology (AEMT) Zhuhai July2012; p.890.10.4028/www.scientific.net/AMR.538-541.890 ↗
39. 10.1115/1.282402810.1115/1.2824028 ↗
40. 10.1115/1.283005110.1115/1.2830051 ↗
41. 10.1109/TEPM.2005.85306810.1109/TEPM.2005.853068 ↗
42. 10.1016/S0017-9310(02)00403-910.1016/S0017-9310(02)00403-9 ↗
43. 10.1016/S1359-6454(98)00190-610.1016/S1359-6454(98)00190-6 ↗
44. 10.1080/10407782.2012.65445610.1080/10407782.2012.654456 ↗
45. 10.1063/1.85872410.1063/1.858724 ↗
46. 10.1016/j.actamat.2009.08.06310.1016/j.actamat.2009.08.063 ↗
47. 10.1088/1361-6463/aa760e10.1088/1361-6463/aa760e ↗
48. 10.1016/S0017-9310(02)00170-910.1016/S0017-9310(02)00170-9 ↗
49. 10.1016/j.ijheatmasstransfer.2011.12.01010.1016/j.ijheatmasstransfer.2011.12.010 ↗
50. R. K.Shukla S. K.Yadav M. H.Shete A.Kumar in5th Int. and 26th All India Manufacturing Technology Design and Research (AIMTDR) Conf. Indian Institute of Technology Guwahati Guwahati India December 2014 p.307.
51. F.Azarmi A.Moradian J.Mostaghimi T. W.Coyle L.Pershin in5th Int. Conf. on Processing and Manufacturing of Advanced Materials Vancouver Canada 2007. July 2006; p.1218.10.4028/0-87849-428-6.1218 ↗
52. 10.1016/j.surfcoat.2009.10.02810.1016/j.surfcoat.2009.10.028 ↗
53. 10.1007/s10853-006-1129-x10.1007/s10853-006-1129-x ↗
54. 10.1007/s11666-009-9414-210.1007/s11666-009-9414-2 ↗
55. 10.1016/0301-9322(94)00069-V10.1016/0301-9322(94)00069-V ↗
56. 10.1016/S0257-8972(02)00471-110.1016/S0257-8972(02)00471-1 ↗
57. 10.1080/0272635080261178810.1080/02726350802611788 ↗
58. 10.1016/j.euromechflu.2021.01.01310.1016/j.euromechflu.2021.01.013 ↗
59. 10.1115/1.290935310.1115/1.2909353 ↗
60. D. W.Tian C. Q.Wang Y. H.Tian in8th Int. Conf. on Electronics Packaging Technology Shanghai P. R. China August2007 p.435.
61. 10.1016/j.rcim.2019.10189810.1016/j.rcim.2019.101898 ↗
62. 10.1088/0022-3727/41/24/24550310.1088/0022-3727/41/24/245503 ↗
63. 10.1007/s10853-009-3253-x10.1007/s10853-009-3253-x ↗
64. 10.1016/S0017-9310(01)00336-210.1016/S0017-9310(01)00336-2 ↗
65. 10.1016/j.ijmachtools.2019.10347410.1016/j.ijmachtools.2019.103474 ↗
66. Huang J. G. · Appl. Therm. Eng. · 2021 · 183
67. 10.1016/j.ijheatmasstransfer.2022.12290210.1016/j.ijheatmasstransfer.2022.122902 ↗
68. 10.1016/j.commatsci.2012.07.03410.1016/j.commatsci.2012.07.034 ↗
69. 10.1016/S1003-6326(14)63261-110.1016/S1003-6326(14)63261-1 ↗
70. 10.1016/j.applthermaleng.2018.12.01310.1016/j.applthermaleng.2018.12.013 ↗
71. 10.1016/j.ijheatmasstransfer.2021.12110010.1016/j.ijheatmasstransfer.2021.121100 ↗
72. 10.1007/s00339-016-0611-910.1007/s00339-016-0611-9 ↗
73. 10.1016/j.ijthermalsci.2015.04.01610.1016/j.ijthermalsci.2015.04.016 ↗
74. Y. P.Chao L. H.Qi X. H.Zeng J.Luo H.Huang inInt. Conf. on Manufacturing Science and Engineering (ICMSE 2009) December 2009 p.4028.10.4028/www.scientific.net/AMR.97-101.4028 ↗
75. 10.1088/0960-1317/26/9/09501210.1088/0960-1317/26/9/095012 ↗
76. 10.1109/TEPM.2008.92628510.1109/TEPM.2008.926285 ↗
77. 10.1016/j.jmapro.2015.12.00310.1016/j.jmapro.2015.12.003 ↗
78. 10.1007/s12206-020-0711-510.1007/s12206-020-0711-5 ↗
79. 10.1016/j.addma.2021.10241310.1016/j.addma.2021.102413 ↗
80. 10.1179/09506609779009320810.1179/095066097790093208 ↗
81. 10.1533/9781845693787.1.4310.1533/9781845693787.1.43 ↗
82. 10.1126/science.106860910.1126/science.1068609 ↗
83. 10.1016/S0921-5093(02)00251-410.1016/S0921-5093(02)00251-4 ↗
84. 10.1016/j.surfcoat.2011.06.03210.1016/j.surfcoat.2011.06.032 ↗
85. 10.1179/mst.1986.2.3.25710.1179/mst.1986.2.3.257 ↗
86. 10.1016/0257-8972(87)90003-X10.1016/0257-8972(87)90003-X ↗
87. 10.1007/BF0322016410.1007/BF03220164 ↗
88. 10.1016/S0257-8972(98)00667-710.1016/S0257-8972(98)00667-7 ↗
89. 10.1007/s11666-018-0781-410.1007/s11666-018-0781-4 ↗
90. V.Verma S.Patel V.Swarnkar S. K.Rajput inInt. Conf. on Recent Advances in Materials Mechanical and Civil Engineering (ICRAMMCE) Hyderabad India 2018. June 2017.
91. 10.1016/j.surfcoat.2017.05.00710.1016/j.surfcoat.2017.05.007 ↗
92. 10.1109/TADVP.2005.84783610.1109/TADVP.2005.847836 ↗
93. 10.1063/1.296411810.1063/1.2964118 ↗
94. 10.1109/TCAPT.2006.88051910.1109/TCAPT.2006.880519 ↗
95. D. B.Wallace D. J.Hayes M.Int inInt. Symp. on Microelectronics Philadelphia PA October 1997 p.681.
96. 10.1142/S096031319800019710.1142/S0960313198000197 ↗
97. D. J.Hayes W. R.Cox M. E.Grove Blackwell Publishing Ltd. Hoboken NJ2001.
98. 10.1016/j.jmatprotec.2021.11726810.1016/j.jmatprotec.2021.117268 ↗
99. 10.1016/S0141-6359(99)00015-X10.1016/S0141-6359(99)00015-X ↗
100. 10.1016/j.jmatprotec.2005.11.02810.1016/j.jmatprotec.2005.11.028 ↗