Porous Microstructure‐Assisted Flexible and Highly Sensitive Polymer Piezoresistive Pressure Sensor
Source abstract
Abstract
Flexible and wearable pressure sensors are gaining attention due to their widespread applications in biomedical, intelligent, and smart systems. However, developing highly sensitive sensors for low pressures and wide ranges is still a challenge. In this direction, a flexible PDMS‐based pressure sensor is presented, having hemispherical microstructures to achieve high sensitivity and operation range. Several experiments with various dimensions have demonstrated that the sensor with microstructures of radii 100 μm on a 0.5 mm‐thick substrate shows optimum performance for a low‐pressure range of less than 6 kPa. Further, a finite‐element method‐based simulation has illustrated improvement in the sensor response with the decrease in substrate thickness. In practice, a very thin film of the substrate is not suitable for detecting a wide range of pressure. The presence of microstructures, however, improves the performance. Adding porosity to the substrate further elevates the sensitivity to 9.51 kPa−1 for a low‐pressure range of less than 10 kPa. Even for medium (30–70 kPa) and high‐pressure ranges (40–120 kPa), the sensitivities of the sensor proposed are as high as 0.045 and 0.17 kPa−1, respectively. The proposed sensors show at least an order improvement of sensitivities compared with the prior arts.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Gas Sensing Nanomaterials and Sensors · Conducting polymers and applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
i-lab Department of Electrical Engineering and Computer Science Indian Institute of Science Education and Research (IISER) Bhopal MP 462066 India
Funding
Indian Council of Medical Research
References (54)
Show source-provided references
1. 10.3390/mi911058010.3390/mi9110580 ↗
2. 10.1016/j.jmst.2019.11.01010.1016/j.jmst.2019.11.010 ↗
3. 10.1002/adma.20170037510.1002/adma.201700375 ↗
4. 10.1109/JIOT.2021.305146710.1109/JIOT.2021.3051467 ↗
5. 10.1109/JSEN.2020.296966710.1109/JSEN.2020.2969667 ↗
6. 10.1002/aelm.20200044510.1002/aelm.202000445 ↗
7. 10.1016/j.nanoen.2021.10650210.1016/j.nanoen.2021.106502 ↗
8. 10.1016/j.compscitech.2021.10904510.1016/j.compscitech.2021.109045 ↗
9. 10.1016/j.snb.2019.12710110.1016/j.snb.2019.127101 ↗
10. 10.1007/s10544-007-9073-310.1007/s10544-007-9073-3 ↗
11. 10.1039/C4MH00147H10.1039/C4MH00147H ↗
12. 10.1002/smtd.20200104110.1002/smtd.202001041 ↗
13. Yeo J. C. · Microsyst. Nanoeng. · 2016 · 2 · 1
14. 10.1038/ncomms283210.1038/ncomms2832 ↗
15. 10.1021/acsami.7b0197910.1021/acsami.7b01979 ↗
16. 10.1002/adma.20130424810.1002/adma.201304248 ↗
17. 10.1002/adma.20130224010.1002/adma.201302240 ↗
18. 10.1021/acs.langmuir.0c0268510.1021/acs.langmuir.0c02685 ↗
19. 10.3906/elk-1812-12110.3906/elk-1812-121 ↗
20. 10.1039/c2lc20982a10.1039/c2lc20982a ↗
21. a)R.Matsuda S.Mizuguchi F.Nakamura T.Endo G.Inamori Y.Isoda H.Ota inIEEE 33rd Int. Conf. Micro Electro Mechanical Systems (MEMS) IEEE Piscataway NJ2020;
22. 10.1088/2053-1591/ab091a10.1088/2053-1591/ab091a ↗
23. 10.1021/acsami.6b0517710.1021/acsami.6b05177 ↗
24. b)L.Singh D.Baidya M.Bhattacharjee inIEEE Int. Conf. Flexible and Printable Sensors and Systems (FLEPS) IEEE Piscataway NJ2022.
25. 10.1016/j.sna.2019.11178910.1016/j.sna.2019.111789 ↗
26. 10.1038/nmat283410.1038/nmat2834 ↗
27. 10.1007/s12668-014-0151-810.1007/s12668-014-0151-8 ↗
28. 10.1038/srep1511910.1038/srep15119 ↗
29. 10.1021/acsami.8b1353510.1021/acsami.8b13535 ↗
30. 10.3390/s807431810.3390/s8074318 ↗
31. O.Ozioko M.Hersh R.Dahiya IEEE Sensors IEEE Piscataway NJ2018.
32. 10.1039/D0TA08223F10.1039/D0TA08223F ↗
33. 10.1063/1.485645510.1063/1.4856455 ↗
34. 10.1021/acsami.7b0611910.1021/acsami.7b06119 ↗
35. 10.1002/smll.20170414910.1002/smll.201704149 ↗
36. 10.1016/j.sna.2016.01.03710.1016/j.sna.2016.01.037 ↗
37. 10.3390/polym1207149910.3390/polym12071499 ↗
38. 10.3390/s1612214810.3390/s16122148 ↗
39. 10.1016/j.compositesb.2021.10924310.1016/j.compositesb.2021.109243 ↗
40. 10.1016/j.snb.2019.01.04310.1016/j.snb.2019.01.043 ↗
41. 10.1007/s40820-019-0337-210.1007/s40820-019-0337-2 ↗
42. 10.4186/ej.2021.25.4.1110.4186/ej.2021.25.4.11 ↗
43. 10.1016/j.msea.2010.11.02510.1016/j.msea.2010.11.025 ↗
44. 10.1016/j.mee.2010.12.10810.1016/j.mee.2010.12.108 ↗
45. 10.1201/b1031810.1201/b10318 ↗
46. 10.1002/adma.1997009021110.1002/adma.19970090211 ↗
47. 10.1002/(SICI)1521-4095(200004)12:7<481::AID-ADMA481>3.0.CO;2-C10.1002/(SICI)1521-4095(200004)12:7<481::AID-ADMA481>3.0.CO;2-C ↗
48. 10.1016/S0379-6779(03)00280-710.1016/S0379-6779(03)00280-7 ↗
49. 10.1016/0301-0104(95)00026-K10.1016/0301-0104(95)00026-K ↗
50. 10.1021/am201352w10.1021/am201352w ↗
51. 10.1016/j.compositesa.2021.10629910.1016/j.compositesa.2021.106299 ↗
52. 10.1016/j.mee.2008.10.02410.1016/j.mee.2008.10.024 ↗
53. 10.1039/C9NR02672J10.1039/C9NR02672J ↗
54. 10.1108/SR-07-2016-011410.1108/SR-07-2016-0114 ↗