Electrochemical Migration of Sintered Nanosilver Under Chloride-Containing Thin Electrolyte Layer for Power Electronic Packaging
Source abstract
Abstract
The electrochemical migration (ECM) of sintered nanosilver in thin electrolyte layers with various chloride concentrations was investigated by in situ and ex situ characterizations. There are two ECM products, i.e., the cloud-like layer and branched dendrites, in both electrolytes with 0 ppm and 10 ppm of NaCl. Only the dendrites, however, could be observed in 100, 200, and 300 ppm NaCl electrolyte layers. The cloud-like layer product is attributed to formation and reduction of Ag2O. However, the formation of Ag2O is inhibited by formation of AgCl in 100, 200, and 300 ppm NaCl electrolyte layers. No ECM products were present in 400 ppm NaCl electrolyte layer, but precipitates of silver compounds were because of formation of insoluble precipitates at anodes. A proposed mechanism has been discussed experimentally in order to understand the effect of Cl− on the electrochemical migration of sintered nanosilver.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Advanced Thermoelectric Materials and Devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
*Key Laboratory of Advanced Ceramics and Machining Technology of Ministry of Education, Tianjin University, Tianjin, 300072, China.
**Tianjin Key Laboratory of Advanced Joining Technology, and School of Materials Science and Engineering, Tianjin University, Tianjin, 300072, China.
***Institute of Machinery Manufacturing Technology, Mianyang, Sichuan Province, China.
****Department of Materials Science and Engineering, Virginia Tech, Blacksburg, VA 24061.
References (41)
Show source-provided references
1. Popovic · IEEE Trans. Power Electron. · 2005 · 20 · 55010.1109/TPEL.2005.846554 ↗
2. Mei · Device Mater. Reliability · 2011 · 11 · 31210.1109/TDMR.2010.2056372 ↗
3. Zhang · IEEE Trans. Electron. Packaging Manufacturing · 2002 · 25 · 27910.1109/TEPM.2002.807719 ↗
4. Lei · IEEE Trans. Components Packaging Technol. · 2010 · 33 · 9810.1109/TCAPT.2009.2021256 ↗
5. Bai · IEEE Trans. Device Mater. Reliability · 2006 · 6 · 43610.1109/TDMR.2006.882196 ↗
6. Wang · J. Electron. Mater. · 2007 · 36 · 133310.1007/s11664-007-0230-5 ↗
7. Minzari · Corros. Sci. · 2011 · 53 · 336610.1016/j.corsci.2011.06.015 ↗
8. Dumoulin · 1982 · 479
9. Minzari · 2009 · 392
10. Jung · J. Electron. Mater. · 2008 · 37 · 111110.1007/s11664-008-0491-7 ↗
11. Medgyes · J. Mater. Sci. Mater. Electron. · 2012 · 23 · 55110.1007/s10854-011-0435-5 ↗
12. Minzari · Corros. Sci. · 2011 · 53 · 165910.1016/j.corsci.2011.01.009 ↗
13. Zhong · Electrochem. Commun. · 2013 · 27 · 6310.1016/j.elecom.2012.11.010 ↗
14. Zhong · Corros. Sci. · 2013 · 66 · 1410.1016/j.corsci.2012.08.040 ↗
15. Zhong · Corros. Sci. · 2013 · 74 · 7110.1016/j.corsci.2013.04.015 ↗
16. Bard · 2000
17. Ripka · Electrocomp Sci. Technol. · 1985 · 11 · 281
18. Noh · Microelectron. Eng. · 2013 · 103 · 110.1016/j.mee.2012.08.013 ↗
19. Kim · J. Nanosci. Nanotechnol. · 2013 · 13 · 762010.1166/jnn.2013.7846 ↗
20. Zhu · Rare Met. · 2012 · 31 · 6410.1007/s12598-012-0464-0 ↗
21. “Investigating of Electrochemical Migration on Low-Ag Lead-Free Solder Alloys,”
22. Lin · Mater. Chem. Phys. · 1996 · 43 · 25610.1016/0254-0584(95)01642-8 ↗
23. Lin · J. Electrochem. Soc. · 1997 · 144 · 165210.1149/1.1837655 ↗
24. Lee · Met. Mater. Int. · 2010 · 16 · 78910.1007/s12540-010-1015-6 ↗
25. Medgyes · J. Mater. Sci. Mater. Electron. · 2013 · 24 · 231510.1007/s10854-013-1095-4 ↗
26. Yoo · Met. Mater. Int. · 2010 · 16 · 73910.1007/s12540-010-1007-6 ↗
27. Medgyes · J. Mater. Sci. Mater. Electron. · 2011 · 22 · 69410.1007/s10854-010-0198-4 ↗
28. Noh · J. Electron. Mater. · 2011 · 40 · 3510.1007/s11664-010-1408-9 ↗
29. Noh · Microelectron. Reliability · 2008 · 48 · 65210.1016/j.microrel.2007.09.006 ↗
30. Li · Appl. Phys. Lett. · 2006 · 89 · 11211210.1063/1.2353813 ↗
31. Lu · Mater. Chem. Phys. · 2015 · 151 · 1810.1016/j.matchemphys.2014.12.001 ↗
32. Sharifpur · Int. J. Heat Mass Transfer · 2015 · 68 · 20810.1016/j.icheatmasstransfer.2015.09.002 ↗
33. Guascito · Atmos. Environ. · 2015 · 116 · 14610.1016/j.atmosenv.2015.06.028 ↗
34. Pourbaix · 1979
35. Morselli · Appl. Phys. A · 2004 · 79 · 36310.1007/s00339-004-2536-y ↗
36. Bernardi · Appl. Phys. A · 2008 · 92 · 8310.1007/s00339-008-4451-0 ↗
37. Yokoyama · Corros. Sci. · 2011 · 53 · 333110.1016/j.corsci.2011.06.010 ↗
38. Zhong · J. Electrochem. Soc. · 2013 · 160 · D49510.1149/2.014311jes ↗
39. Sun · 2013 · 3227
40. Noh · J. Electron. Mater. · 2009 · 38 · 90210.1007/s11664-009-0737-z ↗
41. Noh · J. Mater. Sci. Mater. Electron. · 2008 · 19 · 95210.1007/s10854-007-9421-3 ↗