journal article·2019-02

High Power Factors of Thermoelectric Colusites Cu26T2Ge6S32 (T = Cr, Mo, W): Toward Functionalization of the Conductive “Cu–S” Network

Ventrapati Pavan Kumar, Andrew R. Supka, Pierric Lemoine, Oleg I. Lebedev, Bernard Raveau, Koichiro Suekuni, Vivian Nassif, Rabih Al Rahal Al Orabi, Marco Fornari, Emmanuel Guilmeau

Advanced Energy Materials· Volume 9· Issue 6
Publisher page

Abstract

Abstract The introduction of hexavalent T6+ cations in p‐type thermoelectric colusites Cu26T2Ge6S32 (T = Cr, Mo, W) leads to the highest power factors among iono‐covalent sulfides, ranging from 1.17 mW m−1 K−2 at 700 K for W to a value of 1.94 mW m−1 K−2 for Cr. In Cu26Cr2Ge6S32, ZT reaches values close to unity at 700 K. The improvement of the transport properties in these new sulfides is explained on the basis of electronic structure and transport calculations keeping in mind that the relaxation time is significantly influenced by the size and the electronegativity of the interstitial T cation. The rationale is based on the concept of a conductive “Cu–S” network, which in colusites corresponds to the more symmetric parent structure sphalerite. A detailed structural analysis of these colusites shows that the distortion of the conductive network is influenced by the presence in the structure of mixed octahedral–tetrahedral [TS4]Cu6 complexes where the T cations are underbonded to sulfur and form metal–metal interactions with copper, Cu–T distances decreasing from 2.76 Å for W to 2.71 Å for Cr. The interactions between these complexes are responsible for the outstanding electronic transport properties. By contrast, the thermal conductivity is not significantly affected.
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Research context

OpenAlex topics: Advanced Thermoelectric Materials and Devices · Thermal Expansion and Ionic Conductivity · Chalcogenide Semiconductor Thin Films

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

CRISMAT CNRS Normandie Univ ENSICAEN UNICAEN 14000 Caen France

Department of Physics and Science of Advanced Materials Program Central Michigan University Mt. Pleasant MI 48859 USA

Univ Rennes CNRS ISCR – UMR 6226 F‐35000 Rennes France

Department of Applied Science for Electronics and Materials Interdisciplinary Graduate School of Engineering Sciences Kyushu University Kasuga Fukuoka 816‐8580 Japan

Univ. Grenoble Alpes F‐38000 Grenoble, France and CNRS, Inst. NEEL F‐38042 Grenoble France

Solvay Design and Development of Functional Materials Department Axel'One 87 avenue des Frères Perret, 69192 Saint Fons Cedex France

Funding

Agence Nationale de la Recherche

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