Rate-dependent mechanical behavior of dual-phase structure of Sn interconnect materials
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Abstract
Abstract This study systematically investigates the effects of strain rate (from 1.67 × 10⁻5 to 10⁻1 s⁻1) on the tensile deformation and fracture behavior of β-Sn-based dual-phase alloys including Sn5Sb, Sn25Sb, Sn37Pb, and Sn58Bi. Both pure Sn and Sn5Sb exhibit an increased elongation with rising the strain rate, while Sn25Sb, Sn37Pb, and Sn58Bi display inversely a reduced ductility. At low strain rates, Sn37Pb and Sn58Bi demonstrate a superplastic behavior characterized by the stress index n values of 3.4 and 4.3, respectively, indicating a dominant deformation mechanism involving grain boundary migration/slip and dislocation climb. At high strain rates, their stress indices abruptly increase to 12.6 and 15.3, suggesting a transition to dislocation slip-controlled deformation. Pure Sn, Sn5Sb, and Sn37Pb maintain ductile fracture throughout the tested strain range, whereas Sn25Sb exhibits a brittle fracture under all loading rates. Notably, Sn58Bi shows a strain rate-dependent fracture mode transition: brittle fracture predominates at low strain rates but shifts to quasi-brittle fracture at elevated rates, revealing its unique strain rate-sensitive fracture mechanism.
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References (84)
Show source-provided references
1. G. Imekova, D. Karimov, N. Nuraje, Z. Toktarbay, Polymerization dynamics of zwitterionic monomers with polyacrylamide for enhanced oil recovery. Eng. Sci. 31, 1260 (2024)
2. H.A. Fetouh, Facile route for processing natural polymers for the formulation of new low-cost hydrophobic protective hybrid coatings for carbon steel in petroleum industry. Polym. Bull. 81(16), 14433–14452 (2024)10.1007/s00289-024-05351-5 ↗
3. N. Mukhametgazy, I.S. Gussenov, K. Togizov, M.E. Sanatbekov, R. Smabaeva, Y. Kanagat, S.E. Kudaibergenov, Rheological study of salted water-based drilling fluid formulations developed using a novel amphoteric terpolymer. Eng. Sci. 31, 1262 (2024)
4. K.M. Kadiev et al., Regeneration of the catalyst precursor for hydroconversion of a blend of petroleum tar and polymer waste. Petroleum Chem. 64, 1194–1201 (2024)10.1134/S0965544124080073 ↗
5. R. Senthil, S.B. Kavukcu, W.S. Vedakumari, Cellulose based biopolymer nanoscaffold: a possible biomedical applications. Inter. J. Biological Macromol. 246, 125656 (2023)10.1016/j.ijbiomac.2023.125656 ↗
6. I.A.U. Kadhim, H.A. Sallal, Z.S.A. Al-Khafaji, A review in investigation of marine biopolymer (chitosan) for bioapplications. ES Mater. Manuf. 21, 828 (2023)
7. K. Rattanasaikaew, P. Chaiyasat, Eco-friendly encapsulation: advancing biopolymer microcapsules for sustainable performance. ES Mater. Manuf. in Press (2025). https://doi.org/10.30919/mm142410.30919/mm1424 ↗
8. M.S. Meyersohn, A. Block, F.S. Bates, M.A. Hillmyer, Tackling the thermodynamic stability of low-ceiling temperature polymers for the preparation of tough and chemically recyclable thermoplastic polyurethane-urea elastomers. Macromolecules 57(19), 9230–9240 (2024)10.1021/acs.macromol.4c01431 ↗
9. P. Vengsungnle, N. Naphon, S. Poojeera, A. Srichat, P. Naphon, Artificial neural network, experimental and numerical study on air cooling rubber mattresses for elderly and bedridden patients. Eng. Sci. 32, 1301 (2024)
10. N. Naphon, S. Poojeera, A. Srichat, P. Vengsungnle, P. Naphon, Development of rubber mattresses with cooling systems to reduce the incidence of pressure sores for the elderly and bedridden patients. Eng. Sci. 30, 1153 (2024)
11. M.H. Mulla, M.N. Norizan, N.F. Mohammad Rawi, M.H. Mohamad Kassim, C.K. Abdullah, N. Abdullah, M.N.F. Norrrahim, A review of fire performance of plant-based natural fibre reinforced polymer composites. Inter. J. Biol. Macromol. 305, 141130 (2025)10.1016/j.ijbiomac.2025.141130 ↗
12. H.A. Colorado, J.M. Henkin, Fire-resistant plants: a review of plant morphology, tissues, habits, ecological adaptations, and other factors contributing to bbioderived environmental solutions and technologies. Eng. Sci. 27, 1024 (2024)
13. A. Reda, M.A. Shahin, P. Montague, Review of material selection for corrosion-resistant alloy pipelines. Eng. Sci. 33, 1373 (2025)
14. A. Phukaoluan, K. Srirussamee, A. Khantachawana, M. Chuchonak, P. Tunthawiroon, Influence of the oxide film on the performance and corrosion resistance of TiNiCu shape memory alloys as the heat engine actuator. Eng. Sci. 31, 1226 (2024)
15. N. Hussain, T. Fu, G. Marques, C. Das, T. Scherer, U. Bog, L. Berner, I. Wacker, R.R. Schröder, J. Aghassi-Hagmann, M. Hirtz, High-resolution capillary printing of eutectic gallium alloys for printed electronics. Adv. Mater. Technol. 6(11), 2100650 (2021)10.1002/admt.202100650 ↗
16. D. Grützmacher, O. Concepción, Q.T. Zhao, D. Buca, Si–Ge–Sn alloys grown by chemical vapour deposition: a versatile material for photonics, electronics, and thermoelectrics. Appl. Phys. A: Mater. Sci. Proc. 129(3), 235 (2023)10.1007/s00339-023-06478-4 ↗
17. M. Battaglia, A. Sellitto, V. Acanfora, M. Zarrelli, A. Riccio, Structural numerical simulations on shape memory alloys based actuators. Eng. Sci. 33, 1337 (2025)
18. N. Pant, W. Lee, N. Sanders, E. Kioupakis, Increasing the mobility and power-electronics figure of merit of AlGaN with atomically thin AlN/GaN digital-alloy superlattices. Appl. Phys. Lett. 121(3), 032105 (2022)10.1063/5.0097963 ↗
19. B. Šarkan, M. Loman, Š Senko, M. Richtář, W. Gołębiowski, Change in engine power in the event of electronic components failures. Archives Automotive Eng. 98(4), 40–55 (2022)
20. M. Arı, S. Aksöz, P. Ata Esener, E. Öztürk, Thermal, electrical, and mechanical properties of Sn-Ag-Zn solder alloys for BGA packaging. Phys. B: Conden. Matt. 699, 416868 (2025)10.1016/j.physb.2024.416868 ↗
21. M.-S. Park, D.-H. Nam, K.-M. Jung, K.-S. Hong, H.-S. Kwon, Effects of the degradation of methane sulfonic acid electrolyte on the collapse failure of Sn–Ag alloy solders for flip-chip interconnections. RSC Adv. 7(37), 23136 (2017)10.1039/C7RA02193C ↗
22. E.A. Eid, A. Fawzy, M.M. Mansour, G. Saad, M. Amin, The role of Ni minor additions on the mechanical characteristics of Sn-1.5Ag-0.5 wt% Cu (SAC155) Pb-free solder alloy. J. Mater. Sci.: Mater. Electro. 35(32), 2092 (2024)
23. F. Li, L. Xu, M. Chen, F. Zhang, Z. Wang, X. Liu, H. He, Effects of Ga addition on the microstructure and mechanical performance of Sn-58Bi based alloys and the solder joints. J. Mater. Sci.: Mater. Electron. 35(34), 2159 (2024)
24. O.S.S.S. Chowdary, N. Naik, V. Patil, K. Adhikari, B.M.Z. Hameed, B.P. Rai, B.K. Somani, 5G technology is the future of healthcare: opening up a new horizon for digital transformation in healthcare landscape. ES Gen. 2, 1010 (2023)
25. P. Lavanya, I. Reddy, V. Selvakumar, Long range radio technology implementation on internet of things to detect particulate matter at the community level and prediction using machine learning based approach. Eng. Sci. 29, 1119 (2024)
26. B. Farhadi, A. Masoud Rahmani, P. Asghari, M. Hosseinzadeh, Friendship selection and management in social internet of things: a systematic review. Comp. Net. 201, 108568 (2021)10.1016/j.comnet.2021.108568 ↗
27. T. Baig, D. Ather, S. Setia, S.J. Quraishi, S.M. Mian, Towards advanced animal care: a Li-Fi and IoT-based system for monitoring newborn livestock. ES Mater. Manuf. 23, 1038 (2024)
28. Z. Zhang, S. Zhou, A decentralized strongly secure attribute-based encryption and authentication scheme for distributed Internet of Mobile Things. Comput. Netw. 201, 108553 (2021)10.1016/j.comnet.2021.108553 ↗
29. R. Ranjan, B. Ch, R. Sahana, A comprehensive roadmap for transforming healthcare from hospital-centric to patient-centric through healthcare internet of things (IoT). Eng. Sci. 30, 1175 (2024)
30. M. Malik, M. Dutta, J. Granjal, IoT-sentry: a cross-layer-based intrusion detection system in standardized internet of things. IEEE Sensors J. 21(24), 28066–28076 (2021)10.1109/JSEN.2021.3124886 ↗
31. C. Wattanapanich, T. Imjai, F. Kefyalew, P. Aosai, R. Garcia, S. Vapppangi, T. Noguchi, Integration of internet of things (IoT) and machine learning for management of ground water banks in drought-prone areas: a case study from Imjai organic garden, Thailand. Eng. Sci. 31, 1248 (2024)
32. X. Zhao, J. Li, C. Hu, Y. Qi, Z. Zhou, D. Kou, W. Zhou, S. Yuan, S. Wu, Revealing the role of hydrogen in highly efficient Ag-substituted CZTSSe photovoltaic devices: photoelectric properties modulation and defect passivation. Nano-Micro Lett. 17(1), 84 (2025)10.1007/s40820-024-01574-3 ↗
33. T. Jearsiripongkul, P. Prempraneerach, M. Eslami, M.A. Moarrefi, A novel hybrid metaheuristic approach to parameter estimation of photovoltaic solar cells and modules. Eng. Sci. 27, 979 (2024)
34. M. Chaskar, V. Kadam, C. Jagtap, N. Naik, S. Jadkar, H. Pathan, P. Adhyapak, Enhancement of photovoltaic performance of dye-sensitized solar cells using hierarchical zinc oxide/tin oxide (ZnO/SnO2) nanocomposites synthesized via hydrothermal method. ES Energy Environ. 26, 1250 (2024)
35. S.A. Baqraf, M.A. Gondal, M.A. Dastageer, R. Muhammad, A. Al-Aswad, Parametric optimization of an unmanned three-phase electrodynamic dust shield for sustainable photovoltaic panel operation for dusty environments and space applications. ACS Appl. Energy Mater. 5(12), 15048–15057 (2022)10.1021/acsaem.2c02712 ↗
36. M. Das, Photovoltaic-battery-supercapacitor water pumping system and its reliability under fluctuating environmental conditions. ES Energy Environ. 24, 1128 (2024)
37. W. Li, X.F. Cai, N. Valdes, T. Wang, W. Shafarman, S.H. Wei, A. Janotti, In2Se3, In2Te3, and In2(Se, Te)3alloys as photovoltaic materials. J. Phys. Chem. Lett. 13(51), 12026–12031 (2022)10.1021/acs.jpclett.2c02975 ↗
38. S.P. Gupta, P.P. Sanap, G.V. Dilwale, R.N. Bulakhe, A.D. Jagadale, M.K. Deore, A.B. Bhalerao, C.D. Lokhande, Nanostructured zinc selenide (ZnSe) thin films deposited by various modes of electrodeposition for photovoltaic application. ES Energy Environ. 20, 910 (2023)
39. L. Li, H. Yang, P. Yang, Lutetium-doped ZnO to improve photovoltaic performance: a first-principles study, ACS Appl. Electron. Mater. 4(12), 6253–6260 (2022)
40. K. Jain, V. Agrawal, S.S. Ahmad, S. Mohapatra, P.K. Srivastava, D.B. Narasimha, R. Bhat, Multi-parametric optimization of wired electrical discharge machining process to minimize damage cause in steel—A soft computing based taguchi-grey relation analysis approach. Eng. Sci. 20, 267–274 (2022)
41. J.A. Ang, D.J. Mountain, New horizons for high-performance computing. Computer 55(12), 156–162 (2022)10.1109/MC.2022.3200859 ↗
42. S. Huang, H. Zhang, E. Bao, A comprehensive review of the de bruijn graph and its interdisciplinary applications in computing. Eng. Sci. 28, 1061 (2024)
43. N. Wedi, P. Bauer, I. Sandu, J. Hoffmann, S. Sheridan, R. Cereceda, T. Quintino, D. Thiemert, T. Geenen, Destination earth: high-performance computing for weather and climate. Computer Sci. Eng. 24(6), 29–37 (2022)10.1109/MCSE.2023.3260519 ↗
44. D.R. Kumar, P. Samui, W. Wipulanusat, S. Keawsawasvong, K. Sangjinda, W. Jitchaijaroen, Bearing capacity of eccentrically loaded footings on rock masses using soft computing techniques. Eng. Sci. 24, 929 (2023)
45. D.R. Kumar, P. Samui, W. Wipulanusat, S. Keawsawasvong, K. Sangjinda, W. Jitchaijaroen, Soft computing techniques for predicting penetration and uplift resistances of dual pipelines in cohesive soils. Eng. Sci. 24, 897 (2023)
46. S. Rao, Effect of environmental and operational stresses on electronic components. IETE Tech. Rew. 9(3), 256–257 (1992)10.1080/02564602.1992.11438884 ↗
47. C.-M. Li, S.-J. Chen, S.-S. Cai, J.-B. Peng, X.-J. Wang, Y. Wang, Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging. J. Iron. Steel Res. Int. 30(8), 1650–1660 (2023)10.1007/s42243-023-01027-y ↗
48. M. Yuan, S. Cai, C. Li, X. Wang, C. Liu, Y. Qiao, X. Pang, E.R. Elsharkawy, B. Liu, J. Zhang, Z.M. El-Bahy, C. Chen, M.M. Ibrahim, Z. Guo, Influence of trace Mn doping on the high-speed shear performance of lead-free alloy/copper solder joints: Experimental and first principles investigation. Surf. Interface 51, 104477 (2024)10.1016/j.surfin.2024.104477 ↗
49. F. Liu, Z. Wang, J. Zhou, Y. Wu, Z. Wang, Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. Soldering Surf. Mount Technol. 36(3), 174–184 (2024)10.1108/SSMT-08-2023-0044 ↗
50. Q. Wang, S. Cai, S. Yang, Y. Yu, Y. Wan, J. Peng, J. Wang, X. Wang, Comparison of high-speed shear properties of low-temperature Sn-Bi/Cu and Sn-In/Cu solder joints. J. Mater. Sci.: Mater. Electron. 35, 576 (2024)
51. K.-N. Tu, C. Chen, H.-M. Chen, Electronic packaging science and technology (Wiley, Hoboken, 2022)
52. L. Zhang, S.B. Xue, G. Zeng, L.L. Gao, H. Ye, Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging. J. Alloys Compd. 510(1), 38–45 (2012)10.1016/j.jallcom.2011.08.044 ↗
53. L. Zhang, Z. Liu, Inhibition of intermetallic compounds growth at Sn–58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm). J. Mater. Sci.: Mater. Electron. 31(3), 2466–2480 (2020)
54. X. Wang, L. Zhang, C. Chen, X. Lu, Effect of AlN on the microstructure evolution of Cu/Sn58Bi/Cu solder joints for 3D packaging at different bonding times. J. Mater. Res. Technol. 25, 4488–4496 (2023)10.1016/j.jmrt.2023.06.245 ↗
55. F. Hadian, M. Genanu, R. Owen, J. Flores, E. J. Cotts, Basic parameters controlling current stressing lifetime of SAC305/SN57Bi1Ag mixed solder joints, Proc. SMTA Int. 319–325 (2020).
56. J. Huang, Y. Zhu, K. Pan, X. Wang, Z. Huang, D. Xiao, H. Jiang, Polarity effect of interfacial intermetallic compounds of BGA structure Cu/Sn–52In/Cu solder joints during electromigration. Intermetallic 168, 108252 (2024)10.1016/j.intermet.2024.108252 ↗
57. C. Liu, J. Peng, J. Hu, S. Cai, X. Wang, Effects of phosphorus and germanium on oxidation microstructure of Sn–0.7 Cu lead-free solders. J. Mater Sci.: Mater. Electron. 34(1), 20 (2023)
58. B. Liu, K. Matsugi, Z. Xu, Y. Choi, K. Suetsugu, J.J.M.T. Yu, Effect of indium on microstructures and mechanical properties of bismuth-based high temperature solders. Mater. Trans. 65(10), 1239–1243 (2024)10.2320/matertrans.MT-M2024067 ↗
59. M. Hasnine, B. Tolla, N. Vahora, Microstructural evolution and mechanical behavior of high temperature solders: effects of high temperature aging. J. Electron. Mater. 47(4), 2488–2498 (2018)10.1007/s11664-017-6042-3 ↗
60. X. Wang, S. Zhang, J. Zhang, S. Cai, N. Liu, Y. Wang, A synchronous improvement of strength and elongation caused by solid solution in low-silver SAC solder with superior necking resistance properties. J. Mater. Res. Technol. 33, 6397–6407 (2024)10.1016/j.jmrt.2024.10.208 ↗
61. Q. Li, C. Li, X. Wang, S. Cai, J. Peng, S. Chen, J. Wang, X. Yuan, Microstructure and shear properties evolution of minor Fe-doped SAC/Cu substrate solder joint under isothermal aging. Acta Metall. Sin. 37(7), 1279–1290 (2024)10.1007/s40195-024-01691-3 ↗
62. D. Mu, H. Yasuda, H. Huang, K. Nogita, Growth orientations and mechanical properties of Cu6Sn5 and (Cu, Ni)6Sn5 on poly-crystalline Cu. J. Alloys Compd. 536, 38–46 (2012)10.1016/j.jallcom.2012.04.110 ↗
63. X. Wu, J. Wu, X. Wang, J. Yang, M. Xia, B. Liu, Effect of In addition on microstructure and mechanical properties of Sn–40Bi alloys. J. Mater. Sci. 55, 3092–3106 (2020)10.1007/s10853-019-04148-6 ↗
64. S. Cai, X. Luo, J. Peng, Z. Yu, H. Zhou, N. Liu, X. Wang, Deformation mechanism of various Sn-x Bi alloys under tensile tests. Adv. Compos. Hybrid Mater. 4, 379–391 (2021)10.1007/s42114-021-00231-2 ↗
65. S. Wang, J. Feng, Z. Sa, Y. Wang, S. Wang, Y. Tian, Interfacial reaction of Cu/SnPbInBiSb/Cu sandwich solder joints, 2022 23rd Inter. Conf. Electronic Packaging Technol. (ICEPT), IEEE. 1–5 (2022).10.1109/ICEPT56209.2022.9873169 ↗
66. S. Belyakov, C. Gourlay, R. Coyle, C. Johnson, B. Arfaei, Microstructure evolution during thermal fatigue of a SAC solder containing 5.5% Sb, Proc. SMTA Int. (2020).
67. A. El-Daly, A. Fawzy, A. Mohamad, A. El-Taher, Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu. J. Alloys Compd. 509(13), 4574–4582 (2011)10.1016/j.jallcom.2011.01.109 ↗
68. T. Dele-Afolabi, M. Azmah Hanim, M. Norkhairunnisa, H. Yusoff, M. Suraya, Growth kinetics of intermetallic layer in lead-free Sn–5Sb solder reinforced with multi-walled carbon nanotubes. J. Mater. Sci. Mater. El. 26, 8249–8259 (2015)10.1007/s10854-015-3488-z ↗
69. C. Li, Y. Yan, T. Gao, G. Xu, The influence of Ag on the microstructure, thermal properties and mechanical behavior of Sn–25Sb-xAg high temperature lead-free solder. Vacuum 185, 110015 (2021)10.1016/j.vacuum.2020.110015 ↗
70. J. Bath, Lead-free soldering process development and reliability (Wiley, Hoboken, 2020)10.1002/9781119482093 ↗
71. P. Lall, M. Saha, J. Suhling, Effect of prolonged storage on high strain rate mechanical properties of QSAC10 and QSAC20 solders after exposure to isothermal aging of 50 °C, 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), IEEE, 1–10 (2022).10.1109/iTherm54085.2022.9899674 ↗
72. S. Belyakov, T. Nishimura, T. Akaiwa, K. Sweatman, K. Nogita, C. Gourlay, Role of Bi, Sb and In in microstructure formation and properties of Sn-0.7 Cu-0.05 Ni-X BGA interconnections, 2019 Inter. Confer. Electronics Packaging (ICEP), IEEE, 235–239(2019).10.23919/ICEP.2019.8733493 ↗
73. S. Lu, Z. Zheng, J. Chen, F. Luo, Microstructure and solderability of Sn-3.5 Ag-0.5 Cu-xBi-ySb solders, 2010 11th Inter. Confer. Electronic Packaging Technology & High Density Packaging, IEEE, 410–412(2010).10.1109/ICEPT.2010.5582854 ↗
74. A.F. Schon, R.V. Reyes, J.E. Spinelli, A. Garcia, B. Silva, Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate. J. Alloys Compd. 809, 151780 (2019)10.1016/j.jallcom.2019.151780 ↗
75. Y. Kariya, T. Niimi, T. Suga, M. Otsuka, Isothermal fatigue properties of Sn–Ag–Cu alloy evaluated by micro size specimen. Mater. Trans. 46, 2309–2315 (2005)10.2320/matertrans.46.2309 ↗
76. A. Telang, T. Bieler, The orientation imaging microscopy of lead-free Sn-Ag solder joints. JOM 57, 44–49 (2005)10.1007/s11837-005-0135-9 ↗
77. T.H. Courtney, Mechanical behavior of materials, Waveland Press (2005).
78. K. Kobayashi, I. Shohji, S. Koyama, H. Hokazono, Fracture behaviors of miniature size specimens of Sn-5Sb lead-free solder under tensile and fatigue conditions. Mater. Sci. Forum 184, 238–245 (2017)
79. T. Kobayashi, M. Yokoi, K. Kobayashi, K. Mitsui, I. Shohji, Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge alloys using tensile properties of miniature size specimens. Solid State Phenom. 273, 83–90 (2018)10.4028/www.scientific.net/SSP.273.83 ↗
80. Y. Toyama, I. Shohji, Effect of strain rate on tensile properties of miniature size lead-free alloys, 2012 35th IEEE/CPMT Inter. Electronics Manufacturing Technol. Confer. (IEMT), IEEE, 1–5 (2012).10.1109/IEMT.2012.6521839 ↗
81. R.B. Vastava, T. Langdon, An investigation of intercrystalline and interphase boundary sliding in the superplastic Pb-62% Sn eutectic. Acta Metallur. 27(2), 251–257 (1979)10.1016/0001-6160(79)90103-2 ↗
82. W. Plumbridge, Solders as high temperature engineering materials. Mater. High Temp. 17(3), 381–387 (2000)10.1179/mht.2000.17.3.002 ↗
83. M. Kerr, N. Chawla, Creep deformation behavior of Sn–3.5 Ag solder/Cu couple at small length scales. Acta. Mater. 52(15), 4527–4535 (2004)10.1016/j.actamat.2004.06.010 ↗
84. Q. Zhu, Z. Wang, S. Wu, J. Shang, Enhanced rate-dependent tensile deformation in equal channel angularly pressed Sn–Ag–Cu alloy. Matr. Sci. Eng. A. 502(1–2), 153–158 (2009)10.1016/j.msea.2008.10.023 ↗