Surface generation mechanism of WC/Co and RB-SiC/Si composites under high spindle speed grinding (HSSG)

1. Surface characteristics and removal mechanism of cemented tungsten carbides in nanoscratching10.1016/j.wear.2010.02.014 ↗

2. Precision grinding of binderless ultrafine tungsten carbide (WC) microstructured surfaces10.1007/s00170-012-4068-5 ↗

3. An overview of silicon carbide device technology10.1063/1.41831 ↗

4. First-principles study of pressure-induced phase transition in silicon carbide10.1016/j.physb.2008.05.028 ↗

5. Fundamentals and general applications of hardmetals

6. Role of microstructure on surface and subsurface damage of sintered silicon carbide during grinding and polishing10.1016/j.wear.2010.09.009 ↗

7. Grinding of WC–Co hardmetals10.1016/S0043-1648(00)00561-5 ↗

8. Tohme · 2007 · 1

9. Brittle materials in nano-abrasive fabrication of optical mirror-surfaces10.1016/j.precisioneng.2007.09.001 ↗

10. Grinding induced damage in ceramics10.1016/S0924-0136(02)00952-4 ↗

11. Phase transformation in high-speed cylindrical grinding of SiC and its effects on residual stresses10.1016/j.matlet.2012.08.119 ↗

12. Indentation fatigue of WC–Co cemented carbides10.1016/j.ijrmhm.2013.04.006 ↗

13. Grinding effects on surface integrity and mechanical strength of WC–Co cemented carbides10.1016/j.procir.2014.04.044 ↗

14. Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding10.1016/j.ijmachtools.2007.10.013 ↗

15. Micro grinding tool for manufacture of complex structures in brittle materials10.1016/j.cirp.2009.03.049 ↗

16. Hardness and deformation of hardmetals at room temperature

17. Ductile-regime grinding: a new technology for machining brittle materials

18. Carlisle · 1997 · 46

19. Specific energy in grinding of tungsten carbides of various grain sizes10.1016/j.cirp.2009.03.026 ↗

20. Fundamental investigation of ultra-precision ductile machining of tungsten carbide by applying elliptical vibration cutting with single crystal diamond10.1016/j.jmatprotec.2014.05.024 ↗

21. Influence of microstructure on ultraprecision grinding of cemented carbides10.1016/j.ijmachtools.2003.10.022 ↗

22. Grinding characteristics, material removal and damage formation mechanisms in high removal rate grinding of silicon carbide10.1016/j.ijmachtools.2010.08.008 ↗

23. Study on removal mechanism and removal characters for SiC and fused silica by fixed abrasive diamond pellets10.1016/j.ijmachtools.2014.04.008 ↗

24. Surface characterization of 6H-SiC (0001) substrates in indentation and abrasive machining10.1016/j.ijmachtools.2003.12.006 ↗

25. Theoretical study on removal rate and surface roughness in grinding a RB-SiC mirror with a fixed abrasive10.1364/AO.48.000904 ↗

26. Brittle–ductile transition phenomena in microindentation and micromachining10.1016/S0007-8506(07)62377-4 ↗

27. The hardness and strength properties of WC–Co composites10.3390/ma4071287 ↗

28. Sub-surface mechanical damage distributions during grinding of fused silica10.1016/j.jnoncrysol.2006.09.012 ↗

29. Indentation hardness and fatigue of the constituents of WC–Co composites10.1016/j.ijrmhm.2014.09.021 ↗

30. Investigation of the sliding contact properties of WC–Co hard metals using nanoscratch testing10.1016/j.wear.2006.11.044 ↗

31. Effect of microstructure on edge wear mechanisms in WC–Co10.1016/j.ijrmhm.2006.04.004 ↗

32. An experimental study on micro-grinding process with nanofluid minimum quantity lubrication (MQL)10.1007/s12541-012-0042-2 ↗

33. Force modeling of micro-grinding incorporating crystallographic effects10.1016/j.ijmachtools.2008.07.004 ↗

34. New insights into phase transformations in single crystal silicon by controlled cyclic nanoindentation10.1016/j.scriptamat.2015.02.008 ↗

35. Nanoindentation tests on diamond-machined silicon wafers10.1063/1.1924895 ↗

36. Amorphization and C segregation based surface generation of reaction-bonded SiC/Si composites under micro-grinding10.1016/j.ijmachtools.2015.05.007 ↗

37. Wheel normal grinding of hard and brittle materials

38. On the mechanism of material removal by fixed abrasive lapping of various glass substrates10.1016/j.wear.2012.11.024 ↗

39. Molecular dynamics modelling of brittle–ductile cutting mode transition: case study on silicon carbide10.1016/j.ijmachtools.2014.10.007 ↗

40. Deformation and removal characteristics in nanoscratching of 6H-SiC with Berkovich indenter10.1016/j.mssp.2014.11.034 ↗

41. A stochastic grinding force model considering random grit distribution10.1016/j.ijmachtools.2008.05.012 ↗

42. Marinescu · 2000

43. Malkin · 2008

44. Hardness properties across multiscales of applied loads and material structures10.1179/1743284712Y.0000000012 ↗

45. Role of microstructure in the grinding and polishing of α-sialon ceramics10.1016/S0955-2219(03)00046-3 ↗