journal article·2023-09

Ultra-precision cutting characteristics of binderless tungsten carbide by in-heat-process laser-assisted diamond machining

Jinyang Ke, Xiao Chen, Changlin Liu, Guoqing Xu, Zhongdi She, Jianguo Zhang, Jianfeng Xu

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Abstract

The study systematically investigates the ductile-brittle transition behavior, material removal mechanism, and end-face turning performance of binderless tungsten carbide using in-process-heat laser-assisted diamond machining. Both numerical simulation analysis and experimental cutting experiments were conducted. To ensure that the laser loading condition and energy distribution were consistent with the ray-tracing simulation and spatial power density distribution measurement, a practical thermal simulation model was created with a semicircular Gaussian distribution. This model was then used to study the temperature distribution, and the material`s thermal transient response to laser radiation was also analyzed in detail. The high-temperature nanoindentation revealed increased ductile machinability due to plastic deformation, microhardness reduction, and Young`s modulus decrease at elevated temperatures, providing fundamental support for the ductile-brittle transition behavior. The ductile-brittle transition depth increased by 247.20% compared to conventional groove cutting without laser assistance. The cutting forces during groove cutting decreased gradually with increasing laser power, but excess laser power may cause fluctuations in cutting forces due to surface high-temperature oxidation and potential thermal expansion. The ductile-brittle transition dynamic behavior analysis, based on the discrete wavelet transform algorithm, showed good consistency with the conventional groove profile analysis. The friction coefficient between the tool rake face and chip decreased with increasing laser power, which facilitated improving the tool life. The statistical analysis of end-face turning experiments based on the Taguchi method indicated that laser power was the most significant factor affecting surface quality. The verification turning experiments validated the determined optimal parametric combination. Ultra-high-quality spherical lenses were obtained in ductile cutting mode with slightly less tool wear, a more homogeneous finish (less than 3 nm in Sa), and more outstanding form accuracy (133 nm in PV) compared to conventional turning without laser assistance.
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References (50)

Show source-provided references
1. CBN tool wear in ductile cutting of tungsten carbide10.1016/S0043-1648(03)00061-9 ↗
2. A study on ultrasonic elliptical vibration cutting of tungsten carbide10.1016/j.jmatprotec.2008.10.047 ↗
3. Characteristics of ultrasonic vibration-assisted ductile mode cutting of tungsten carbide10.1007/s00170-006-0761-6 ↗
4. Review on fabrication technologies for optical mold inserts10.3390/mi10040233 ↗
5. A review on binderless tungsten carbide: development and application10.1007/s40820-019-0346-1 ↗
6. On Atomic and Close-to-atomic Scale Manufacturing——Development Trend of Manufacturing Technology
7. Ductile cutting of tungsten carbide
8. High effective laser assisted diamond turning of binderless tungsten carbide10.1016/j.jmatprotec.2022.117505 ↗
9. A predictive model of the critical undeformed chip thickness for ductile–brittle transition in nano-machining of brittle materials10.1016/j.ijmachtools.2012.08.005 ↗
10. Ductile-Regime Grinding: A New Technology for Machining Brittle Materials10.1115/1.2899676 ↗
11. A review of surface roughness generation in ultra-precision machining10.1016/j.ijmachtools.2015.02.001 ↗
12. Fundamental investigation of ultra-precision ductile machining of tungsten carbide by applying elliptical vibration cutting with single crystal diamond10.1016/j.jmatprotec.2014.05.024 ↗
13. Enhancing the ductile machinability of single-crystal silicon by laser-assisted diamond cutting10.1007/s00170-021-08132-w ↗
14. Subsurface damage and phase transformation in laser-assisted nanometric cutting of single crystal silicon
15. Ductile mode material removal and high-pressure phase transformation in silicon during micro-laser assisted machining10.1016/j.precisioneng.2011.12.003 ↗
16. Experimental investigations on the laser-assisted machining of single crystal Si for optimal machining10.1016/j.optlastec.2021.107113 ↗
17. Experimental investigation on the ductile machinability of fused silica during in-situ laser assisted diamond cutting10.1016/j.jmapro.2022.10.005 ↗
18. Thermal analysis and machinability for laser-assisted machining of fused silica10.1016/j.ijheatmasstransfer.2019.119078 ↗
19. Study on machining characteristics of SiC–Al2O3 reinforced aluminum hybrid nanocomposite in conventional and laser-assisted turning10.1016/j.ceramint.2022.05.196 ↗
20. An investigation of laser-assisted machining of Al2O3 ceramics planing10.1016/j.ijmachtools.2006.06.010 ↗
21. Study on the three-dimensional topography of the machined surface in laser-assisted machining of Si3N4 ceramics under different material removal modes10.1016/j.ceramint.2019.11.017 ↗
22. Laser-assisted grinding of silicon nitride ceramics: Micro-groove preparation and removal mechanism10.1016/j.ceramint.2022.07.180 ↗
23. Mitigation of damage during surface finishing of sapphire using laser-assisted machining10.1016/j.precisioneng.2018.08.012 ↗
24. Advances in laser assisted machining of hard and brittle materials10.1016/j.jmapro.2020.08.034 ↗
25. Analytical Prediction of the Temperature Field in Laser Assisted Machining10.1016/j.procir.2016.04.071 ↗
26. Numerical investigation on subsurface damage in nanometric cutting of single-crystal silicon at elevated temperatures10.1016/j.jmapro.2021.06.040 ↗
27. Numerical investigation on the temperature effect in nanometric cutting of polycrystalline silicon10.1016/j.ijmecsci.2022.107172 ↗
28. Process parameter effects on residual stress and phase purity after microlaser-assisted machining of silicon10.1080/10426914.2018.1453145 ↗
29. Ultraprecision laser-assisted diamond machining of single crystal Ge10.1016/j.precisioneng.2020.04.020 ↗
30. Investigation on the machinability of nitriding mold steel by applying in-situ laser assisted diamond cutting10.1016/j.jmapro.2022.09.055 ↗
31. Surface generation of tungsten carbide in laser-assisted diamond turning10.1016/j.ijmachtools.2021.103770 ↗
32. Experimental investigation on laser assisted diamond turning of binderless tungsten carbide by in-process heating10.3390/mi11121104 ↗
33. Investigation of surface integrity and material removal mechanism of single-crystal Si subjected to micro-laser-assisted machining10.1016/j.infrared.2021.103868 ↗
34. Evaluation of the convective heat transfer coefficient for minimum quantity lubrication (MQL)10.1108/00368791211262516 ↗
35. A research on WC–8Co preparation by microwave sintering10.1016/j.ijrmhm.2012.01.001 ↗
36. Study on the oxidation of WC-Co cemented carbide under different conditions10.1016/j.ijrmhm.2020.105381 ↗
37. Microstructure and properties of W-25 wt% Cu composites reinforced with tungsten carbide produced by an in situ reaction10.1016/j.vacuum.2020.109423 ↗
38. Long-term ball milling and hot pressing of in-situ nanoscale tungsten carbides reinforced copper composite and its characterization10.1016/j.matchar.2019.04.014 ↗
39. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments10.1557/JMR.1992.1564 ↗
40. Anisotropy of Young’s modulus and Poisson’s ratio in diamond10.1016/0025-5408(92)90005-K ↗
41. Optimization parameters of tool life model using the Taguchi approach and response surface methodology
42. Optimization of Processing Parameters During Laser Cladding of ZE41A-T5 Magnesium Alloy Castings Using Taguchi Method10.1080/10426910801940391 ↗
43. Surface roughness optimization of cold-sprayed coatings using Taguchi method10.1007/s00170-011-3642-6 ↗
44. Estimating the effect of cutting data on surface roughness and cutting force during WC-Co turning with PCD tool using Taguchi design and ANOVA analysis10.1007/s00170-014-6382-6 ↗
45. Optimization of cutting parameters for minimizing energy consumption in turning of AISI 6061 T6 using Taguchi methodology and ANOVA10.1016/j.jclepro.2013.03.049 ↗
46. Optimization of Nd:YAG laser parameters for microdrilling of alumina with multiquality characteristics via Grey–Taguchi method10.1080/10426914.2011.585493 ↗
47. The mechanism of ductile chip formation in cutting of brittle materials10.1007/s00170-006-0531-5 ↗
48. Effect of tool rake angle on the material removal mechanism transition of single-crystal silicon: a molecular dynamics study10.1007/s00170-021-07391-x ↗
49. Finite element analysis of the effect of tool rake angle on brittle-to-ductile transition in diamond cutting of silicon10.1007/s00170-019-03888-8 ↗
50. Surface formation mechanism in ultraprecision diamond turning of coarse-grained polycrystalline ZnSe10.1016/j.ijmachtools.2020.103554 ↗