journal article·2009-07

Oxidation and reduction of tungsten alloy swarf

A.A. Alhazza

Publisher page

Abstract

Abstract Oxidation of a heavy metal alloy (swarf) followed by reduction in dry hydrogen atmosphere was studied. The swarf was oxidised at 750 °C to 1000 °C and then reduced at 800 °C. Analysis of the resulting powder was studied using thermogravimetry, X-ray diffraction, and scanning electron microscopy. The average particle size of the reduced powder was 1–3 μm. The chemical composition of the reduced powder was the same as the primary heavy alloy swarf.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (12)

Show source-provided references
1. Cotton FA, Wilkinson G. Advances in organic chemistry. 5th ed. Wiley; 1988.
2. Recent developments in semiconducting thin-film gas sensors10.1016/0925-4005(94)01278-P ↗
3. WO3 sputtered thin films for NOx monitoring10.1016/0925-4005(94)01563-W ↗
4. Yamazoe N, Miura N. New approaches in the design of Gas Sensors. Gas sensors: principles, operation, and developments; 1992.10.1007/978-94-011-2737-0_1 ↗
5. Recycling of heavy metal alloy turnings to powder by oxidation–reduction process10.1016/S0263-4368(03)00009-X ↗
6. The oxidation kinetics of tungsten and the determination of oxygen diffusion coefficient in tungsten trioxide10.1016/0010-938X(80)90092-X ↗
7. Determination of physical characterization of tungsten oxides10.1016/S0263-4368(00)00047-0 ↗
8. Oxidation of tungsten and tungsten carbide in dry and humid atmospheres10.1016/S0263-4368(96)00027-3 ↗
9. Lassner E, Schubert WD. Tungsten properties, chemistry, technology of the element, alloys, and chemical compounds. Kluwer Academic; 1999.10.1007/978-1-4615-4907-9 ↗
10. Tungsten–oxygen system
11. Yih · 1979
12. Schubert W. Kinetics of the hydrogen reduction of tungsten oxides. In: 12th international plansee seminar’89: high temperature and wear resistant materials in a world of changing technology, vol. 4; 1989. p. 41–78.