journal article·2026-07-29

Effect of Trace Phosphorus Addition on the Solidification Behavior and Local Mechanical Response of β-Sn Alloys

Yupeng Wang, Zhuangchao Zhan, Huilin Zhang, Hongbo Qin, Jiaqiang Huang, Wangyun Li, Caihang Liang, Lili Wang, Chengxu Lin, Mingzhen Hu

Crystals· Volume 16· Issue 8
Publisher page

Abstract

To investigate the effects of trace phosphorus (P) addition on the solidification behavior, microstructure, and local mechanical response of β-Sn alloys, Sn–P alloys containing 0.02, 0.05, and 0.08 wt.% P were prepared. Phase constitution, solidification characteristics, and nanomechanical properties were characterized by X-ray diffraction, thermogravimetry–differential scanning calorimetry, and nanoindentation, respectively. Electron backscatter diffraction was additionally conducted on representative pure Sn and Sn–P0.08 samples to qualitatively compare the endpoint microstructures. All alloys were primarily composed of β-Sn, while localized P-rich secondary regions in Sn–P0.08 were indexed as Sn4P3. Trace P promoted heterogeneous nucleation and markedly modified solidification, increasing the solidification peak temperature by approximately 20–22 °C and reducing the undercooling from 39.83 °C to 17.50–20.33 °C. Relative to pure Sn, Sn–P0.08 exhibited more grain regions and grain boundaries, together with pronounced dendritic and locally refined features, indicating modified β-Sn nucleation and growth. Young’s modulus and hardness of Sn–P0.08 reached 29.86 GPa and 0.232 GPa, respectively. Inverse nanoindentation analysis revealed increased representative stress, strain-hardening exponent, and strength coefficient. Fracture-energy analysis showed superior crack-growth energy dissipation for Sn–P0.02, whereas Sn–P0.08 exhibited greater resistance to plastic deformation.
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Research context

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Affiliations

Guangxi Key Laboratory of Advanced Packaging and System Integration, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China

School of Integrated Circuits Science and Engineering, Southwest Jiaotong University, Chengdu 611756, China

Liuzhou Huaxi Nonferrous Design & Research Institute Co., Ltd., Liuzhou 545027, China

Guangxi Key Metal Research Institute Co., Ltd., Nanning 530007, China

Funding

Major Program Project of Guangxi Province · Guangxi Key Laboratory of Advanced Packaging and System Integration · Innovation Project of Guangxi Graduate Education · Innovation Project of GUET Graduate Education

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