Failure mechanics of organic–inorganic multilayer permeation barriers in flexible electronics
Source abstract
Abstract
Abstract Organic–inorganic multilayer permeation barriers are emerging as a promising solution to the stringent barrier requirement of flexible electronics. Yet the mechanical failure of the multilayer permeation barriers could be fatal to their barrier performance. We study two co-evolving failure mechanisms of the multilayer permeation barriers under tension, namely, the cracking of the inorganic oxide layer and the delamination along the oxide–organic interface, using computational modeling. An effective driving force for the oxide layer cracking is determined, which decreases as the oxide–organic interfacial adhesion increases. Emerging from the study is a simple but effective design to enhance the deformability of multilayer permeation barriers by applying a thin protective coating. Further studies show that strong adhesion of the coating-oxide interface is crucial for the coating performance. The results from this study provide quantitative guidance for the material selection and structural optimization of organic–inorganic multilayer permeation barriers of high mechanical durability.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Organic Light-Emitting Diodes Research · Electronic Packaging and Soldering Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (34)
Show source-provided references
1. The path to ubiquitous and low-cost organic electronic appliances on plastic10.1038/nature02498 ↗
2. Macroelectronics: perspectives on technology and applications10.1109/JPROC.2005.851237 ↗
3. Flexible electronics technology, part II: materials and devices10.1109/JPROC.2005.851509 ↗
4. Crawford · 2005
5. Materials and mechanics for stretchable electronics10.1126/science.1182383 ↗
6. Formation and growth of black spots in organic light-emitting diodes10.1063/1.363598 ↗
7. Photo-oxidation of electroluminescent polymers studied by core-level photoabsorption spectroscopy10.1063/1.116298 ↗
8. Investigation of the sites of dark spots in organic light-emitting devices10.1063/1.1320459 ↗
9. Chemical and morphological stability of aluminum tris(8-hydroxyquinoline) (Alq(3)): effects in light-emitting devices10.1109/2944.669465 ↗
10. Water vapor and oxygen degradation mechanisms in organic light emitting diodes10.1002/1616-3028(200104)11:2<116::AID-ADFM116>3.0.CO;2-B ↗
11. Thin film encapsulation for OLEDs: evaluation of multilayer barriers using the Ca test10.1889/1.1832335 ↗
12. Moro L, Krajewski TA, Rutherford N, Philips O, Visser RJ, Gross M, et al. Integrated encapsulation of bottom and top emission OLED displays. SPIE-The Int. Soc. Optic. Eng., Organic Light-Emitting Materials and Devices VIII; 2004.
13. Thin-film permeation-barrier technology for flexible organic light-emitting devices10.1109/JSTQE.2004.824072 ↗
14. Channel cracks in a hermetic coating consisting of organic and inorganic layers10.1063/1.2713134 ↗
15. Thin film encapsulated flexible organic electroluminescent displays10.1063/1.1594284 ↗
16. Erlat AGn, Yan M, R. Duggal A. Substrates and thin-film barrier technology for flexible electronics; 2009. p. 413–49.10.1007/978-0-387-74363-9_13 ↗
17. Gas permeation and lifetime tests on polymer-based barrier coatings10.1117/12.416878 ↗
18. Organic light-emitting devices with extended operating lifetimes on plastic substrates10.1063/1.1514831 ↗
19. Transparent hybrid inorganic/organic barrier coatings for plastic organic light-emitting diode substrates10.1116/1.1913680 ↗
20. Mechanisms of vapor permeation through multilayer barrier films: lag time versus equilibrium permeation10.1063/1.1768610 ↗
21. Cracking of thin bonded films in residual tension10.1016/0020-7683(92)90015-L ↗
22. Mixed-mode cracking in layered materials10.1016/S0065-2156(08)70164-9 ↗
23. Channel-cracking of thin films with the extended finite element method10.1016/S0013-7944(03)00083-3 ↗
24. Channel cracking in thin films on substrates of finite thickness10.1023/A:1024962825938 ↗
25. Constraint effects on thin film channel cracking behavior10.1557/jmr.2005.0317 ↗
26. A four-point bending technique for studying subcritical crack growth in thin films and at interfaces10.1557/JMR.1997.0122 ↗
27. Tunneling cracks in constrained layers10.1115/1.2900998 ↗
28. Delamination in patterned films10.1016/j.ijsolstr.2006.07.023 ↗
29. Buckling and cracking of thin films on compliant substrates under compression10.1023/A:1007628800620 ↗
30. The role of initial flaw size, elastic compliance and plasticity in channel cracking of thin films10.1016/S0040-6090(02)00718-6 ↗
31. Influence of interfacial delamination on channel cracking of elastic thin films10.1007/s10704-008-9205-7 ↗
32. Ductility of thin metal films on polymer substrates modulated by interfacial adhesion10.1016/j.ijsolstr.2006.07.022 ↗
33. Metal films on polymer substrates stretched beyond 50%10.1063/1.2817234 ↗
34. Failure by simultaneous grain growth, strain localization, and interface debonding in metal films on polymer substrates10.1557/JMR.2009.0048 ↗