Via Filling by Electrodeposition

Superconformal deposition of silver in vias was studied. The observed experimental fill behavior is compared with predictions from a model based on the curvature-enhanced accelerator coverage mechanism of superconformal deposition. Superconformal copper deposition and conformal nickel deposition results are also modeled. The previously published model predicts via filling behavior using the dependence of deposition rate kinetics on the coverage of adsorbed catalyst. The requisite kinetic parameters are obtained from independent current-voltage and current-time transient studies conducted on planar substrates. © 2002 The Electrochemical Society. All rights reserved.