Effects of CMP Slurry Chemistry on the Zeta Potential of Alumina Abrasives
Source abstract
Abstract
The colloidal behavior of alumina in typical copper chemical mechanical planarization (CMP) solutions was investigated through the measurement of zeta potential and particle cluster size distribution. The effects of various common additives on zeta potential for alumina slurries used in copper CMP were studied. Addition of to glycine stabilized the zeta potential for alumina for a large pH range. Although slurry pH has the largest effect on zeta potential and particle cluster size distribution, sodium dodecyl sulfate caused alumina to maintain a small aggregate size while ethylenediaminetetraacetic acid caused alumina to agglomerate over the entire pH range investigated.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Surface Polishing Techniques · Advanced machining processes and optimization · Diamond and Carbon-based Materials Research
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