journal article·1995-03-01

Reaction of 1,1,1,5,5,5‐Hexafluoro‐2,4‐pentanedione (H+hfac) with CuO , Cu2 O , and Cu Films

M. A. George, D. W. Hess, S. E. Beck, J. C. Ivankovits, D. A. Bohling, A. P. Lane

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Abstract

The interactions of copper and copper oxide layers with 1,1,1,5,5,5‐hexafluoro‐2,4‐pentanedione (H + hfac) have been investigated. The results provide supporting evidence for proposed reactions of copper with H + hfac which are thought to be responsible for the vapor‐phase etching of copper. Specific reaction products depend on the chemical state of the copper in the film. Reaction of H + hfac with Cu 2+ yields volatile reaction products of and , while Cu 1+ yields the same products with a change in the chemical state of the surface to Cu (0) . No reaction is observable between H + hfac and Cu (0) at temperatures studied in these experiments.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Fluid Dynamics and Thin Films · ZnO doping and properties · Copper-based nanomaterials and applications

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Affiliations

Department of Chemical Engineering, Lehigh University, Bethlehem, Pennsylvania 18015

Air Products and Chemicals, Incorporated, Allentown, Pennsylvania 18195

Texas Instruments, Dallas, Texas 75265

References

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