Growth of Metal around Particles during Electrodeposition
Source abstract
Abstract
The deposition profile of metal around particles during electrodeposition was studied by atomic force microscopy measurements. In addition to these measurements, the local metal deposition rate around particles was determined from electrodeposited nickel–iron multilayers using "process archeology." A strong correlation was found between the metal deposition profile and the surface properties of the particles. Hydrophilic particles are pushed ahead by metal that deposits underneath the particles before they become incorporated. Metal deposition does not take place underneath hydrophobic particles, hence incorporating from the start of the metal deposition. For electrically conductive particles, metal deposits on the particles which causes such particles to incorporate almost immediately.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Force Microscopy Techniques and Applications · Electrochemical Analysis and Applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
Reference metadata was not supplied for this record.