A Study of the Composite Electrodeposition of Copper with Alumina Powder
Source abstract
Abstract
Codeposition of α‐alumina powder in an acidic copper plating solution was studied. We found the zeta potential of γ‐alumina powder to be negative, which is probably the reason why it shows much inferior codeposition as compared with α‐alumina. The agitation of solution also affects the extent of codeposition strongly. The flow of electrolyte is necessary to maintain the particles in suspension. However, with too much agitation, the solution can blow away adsorbed alumina particles.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability
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Affiliations
Department of Chemical Engineering, Tsing‐Hua University, Hsin‐Chu, Taiwan, China
References
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