article·2006-01-01

Role of the Functional Groups of Complexing Agents in Copper Slurries

Udaya B. Patri, Serdar Aksu, S. V. Babu

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Abstract

We investigate the role of – and –COOH functional groups of complexing agents in -based slurries in controlling copper (Cu) removal rates. Slurries containing complexing agents with two of the same functional groups (succinic acid: , ethylene diamine: ) and a complexing agent containing one each of the functional groups (β-alanine: ), all with the same carbon chain length, were investigated. Along with dissolution and disk polish experiments, potential–pH diagrams were constructed for these three systems in the presence of . The dissolution and polish rates are consistent with the known activity of carboxylic acids (with –COOH groups) at acidic conditions and that of amines (with – groups) in an alkaline environment. The observed trends in the removal rates with all these slurries are explained using potential–pH diagrams, UV/visible spectra, and electrochemical experiments. When compared to glycine , β-alanine produced higher removal rates at acidic pH values and lower removal rates at alkaline pH values. Finally, succinic acid and β-alanine-based slurries were found to result in lower dissolution rates and higher polish rates compared to glycine-based slurries at pH 4.
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Research context

OpenAlex topics: Advanced Surface Polishing Techniques · Corrosion Behavior and Inhibition · Advanced Machining and Optimization Techniques

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