Tin Sensitization for Electroless Plating Review
Source abstract
Abstract
Tin sensitization prior to electroless plating improves deposition of metals on a variety of substrates. This review summarizes relevant characteristics of the tin sensitized substrates, pre-treatment of surfaces before tin sensitization, adhesion, one- and two-step tin sensitization processes, photo-selective metal deposition (PSMD), and mechanisms and applications of tin sensitization. Mechanistic improvements to tin sensitization such as addition of aged tin(IV) chloride, and application of accelerators to remove the stannous shell and expose the catalytic core are evaluated. The effect of ultra-violet (UV) light on oxidation of tin(II) sensitized surface are analyzed for PSMD. The application section concludes with examples of tin sensitization in recent use and their commercial relevance.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Corrosion Behavior and Inhibition · Electronic Packaging and Soldering Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (62)
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