The Effect of Glycine and Benzotriazole on Corrosion and Polishing Properties of Cobalt in Acid Slurry
Source abstract
Abstract
Cobalt has caused much interest as an adhesion layer for copper metallization in the next generation interconnect technology. This work investigates the effects of glycine and BTA on corrosion and polishing properties of Co in the acid slurry. The potentiodynamic polarization measurement results show that glycine can increase the corrosion rate of Co. In the solution containing H 2 O 2 , adding glycine can make the Co surface smoother. In the slurry without H 2 O 2 , BTA shows good inhibition effect on Co corrosion. BTA can adsorb on the Co surface through physisorption and chemisorption, and obeys Langmuir absorption isotherm. In the acid slurry with H 2 O 2 , BTA will react with Co 2+ ions and form insoluble networked nanoparticles ([Co(II)(BTA) 2 ·H 2 O] n ) on the Co surface, and induce reduction of the removal rate and static etch rate of Co.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Surface Polishing Techniques · Advanced materials and composites · Metal and Thin Film Mechanics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (31)
Show source-provided references
1. 10.1149/1.192492910.1149/1.1924929 ↗
2. Huang H. Y. Hsieh C. H. Jeng S. M. Tao H. J. Cao M. Mii Y. J. , International Interconnect Tech. Conf., pp. 1 (2010).10.1109/IITC.2010.5510762 ↗
3. Lu J. Ha H. C. Aubuchon J. Ma P. Yu S. H. Narasimhan M. , Adv. Metallization Conf., pp. 21-22 (2008).
4. Ma P. Luo Q. Sundarrajan A. Lu J. Aubuchon J. Tseng J. Okazaki1 N. Kumar,M. Wang Y. Wang Y. Chen Y. Naik M. Emesh I. Narasimhan M. , International Interconnect Tech. Conf., pp. 38–40 (2009).10.1109/IITC.2009.5090334 ↗
5. Jung H. K. Lee H. B. Tsukasa M. Jung E. Yun J. H. Lee J. M. Choi G. H. Choi S. Chung C. , International Reliability Physics Symposium (IRPS), p.3.E.2.1 (2011).10.1109/IRPS.2011.5784492 ↗
6. 10.1149/1.222085210.1149/1.2220852 ↗
7. Heylen N. L. Yunlong Kellens K. Carbonell L. Volders H. Santoro G. Gravey V. Cockburn A. Wang Y. C. Shah K. Leunissen L. Beyer G. P. T¨okei Z. , InternationalInterconnect Tech. Conf., pp. 1 (2010).10.1109/IITC.2010.5510692 ↗
8. 10.1143/JJAP.49.05FC0310.1143/JJAP.49.05FC03 ↗
9. 10.1149/2.073206jes10.1149/2.073206jes ↗
10. Lin · Mater. Res. Soc. Symp. Proc. · 2004 · 795 · 93
11. 10.1016/j.jpowsour.2008.07.01110.1016/j.jpowsour.2008.07.011 ↗
12. 10.1149/1.186911210.1149/1.1869112 ↗
13. 10.1149/1.147443610.1149/1.1474436 ↗
14. 10.1149/1.179525610.1149/1.1795256 ↗
15. 10.1023/A:100389312220110.1023/A:1003893122201 ↗
16. 10.1021/ja01614a08110.1021/ja01614a081 ↗
17. 10.1021/ic00344a03210.1021/ic00344a032 ↗
18. 10.1021/ic50077a03610.1021/ic50077a036 ↗
19. 10.1149/2.017204esl10.1149/2.017204esl ↗
20. 10.1149/1.208595710.1149/1.2085957 ↗
21. 10.1021/jp034334x10.1021/jp034334x ↗
22. 10.1016/j.corsci.2003.10.01310.1016/j.corsci.2003.10.013 ↗
23. 10.1016/S0010-938X(02)00072-010.1016/S0010-938X(02)00072-0 ↗
24. 10.5006/1.358530710.5006/1.3585307 ↗
25. 10.1016/j.electacta.2007.01.05710.1016/j.electacta.2007.01.057 ↗
26. 10.1021/la010575p10.1021/la010575p ↗
27. 10.1021/la981724f10.1021/la981724f ↗
28. 10.1016/j.matchemphys.2007.08.02210.1016/j.matchemphys.2007.08.022 ↗
29. 10.1021/la025570m10.1021/la025570m ↗
30. 10.1016/S0013-4686(02)00834-410.1016/S0013-4686(02)00834-4 ↗
31. 10.1149/1.211400510.1149/1.2114005 ↗