A Model of Chemical Mechanical Polishing
Source abstract
Abstract
A model of chemical mechanical polishing is presented which quantitatively correlates the polishing rate with the slurry concentrations of both chemicals and abrasives. The model predicts that as the concentration of either chemicals or abrasives is increased, an initial steep rise in the polishing rate is followed by an asymptotic approach to a maximum rate. The causes and implications of this behavior are discussed. © 2001 The Electrochemical Society. All rights reserved.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Surface Polishing Techniques · Advanced machining processes and optimization · Mineral Processing and Grinding
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
Reference metadata was not supplied for this record.