Tensile Properties of Nanostructured Ni‐Cu Multilayered Materials Prepared by Electrodeposition

As the layer thicknesses in 90% Ni‐10% Cu multilayered alloys electrodeposited from a sulfamate bath are decreased, the ultimate tensile strength peaks at 1100 MPa for 6–7 nm Cu layers, and then decreases to about 1000 MPa as the Cu layer thickness reaches 1 nm. This decrease in deposit strength is associated with a reduction in the deposit (100) texture caused by the influence of Cu, which has a (110) preferred orientation in the sulfamate system. The results suggest that highly coherent nanostructured multilayers can only be deposited from a single electrolyte if the preferred orientation for the two metals is the same.