Wear‐Contact Problems and Modeling of Chemical Mechanical Polishing
Source abstract
Abstract
Wafer shape and contact pressure evolution during chemical mechanical polishing, and the characteristics of the steady‐state regime are analyzed on the basis of approaches developed in contact mechanics. Nonplanarity caused by the geometrical nonuniformity (erosion) and by the presence of different material on the surface (recess) is considered. The possibility of the process optimization and the determination of system parameters based on the polished surface profiles is discussed.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Surface Polishing Techniques · Advanced machining processes and optimization · Tunneling and Rock Mechanics
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Affiliations
Department of Civil Engineering, Northwestern University, Evanston, Illinois 60208‐3109
Cabot Corporation, Microelectronics Materials Division, Aurora, Illinois 60504
References
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