A Review of Corrosion Failure Mechanisms during Accelerated Tests: Electrolytic Metal Migration
Source abstract
Abstract
This paper presents an extensive literature review and assessment of corrosion failure mechanisms encountered during accelerated tests of microelectronic devices. The failure mechanism of primary emphasis is electrolytic metal migration. The metallurgies of interest are silver, gold, copper, and aluminum. Electrochemical investigations of dendritic growth are also reviewed. Mechanistic results from the electrochemical investigations are discussed in light of the empirical results of accelerated tests.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Hydrogen embrittlement and corrosion behaviors in metals · Corrosion Behavior and Inhibition · Integrated Circuits and Semiconductor Failure Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Chemical Engineering, Vanderbilt University, Nashville, Tennessee 37235
Department of Chemistry, Vanderbilt University, Nashville, Tennessee 37235
IBM Corporation, East Fishkill, Hopewell Junction, New York 12533
References
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