Electrochemical Tunnel Etching of Aluminum
Source abstract
Abstract
Anodic dissolution of aluminum in hot chloride solutions produces a high density of fine etch tunnels that extend along [100] directions. Tunnels evolve from cubic etch pits when all but one of the pit wall surfaces become passivated; dissolution then occurs at the one active face at a rate that may initially be as high as 20 A/cm 2 . Tunnels have square cross sections with sides ∼1 μm and aspect ratios as high as 100:1. Tunnel growth may be considered a unique form of pitting corrosion in which dissolution and passivation occur simultaneously with a sustained balance between the two processes.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Anodic Oxide Films and Nanostructures · Corrosion Behavior and Inhibition · Concrete Corrosion and Durability
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
United Chemi‐Con, Incorporated, Northbrook, Illinois 60062
Electrochemical Technology Corporation, Seattle, Washington 98107
Department of Chemical Engineering, University of Illinois, Urbana, Illinois 61801
References
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