journal article·1984-01-01Open access

Electrochemical Tunnel Etching of Aluminum

R. S. Alwitt, H. Uchi, T. R. Beck, R. C. Alkire

Abstract

Anodic dissolution of aluminum in hot chloride solutions produces a high density of fine etch tunnels that extend along [100] directions. Tunnels evolve from cubic etch pits when all but one of the pit wall surfaces become passivated; dissolution then occurs at the one active face at a rate that may initially be as high as 20 A/cm 2 . Tunnels have square cross sections with sides ∼1 μm and aspect ratios as high as 100:1. Tunnel growth may be considered a unique form of pitting corrosion in which dissolution and passivation occur simultaneously with a sustained balance between the two processes.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Anodic Oxide Films and Nanostructures · Corrosion Behavior and Inhibition · Concrete Corrosion and Durability

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

United Chemi‐Con, Incorporated, Northbrook, Illinois 60062

Electrochemical Technology Corporation, Seattle, Washington 98107

Department of Chemical Engineering, University of Illinois, Urbana, Illinois 61801

References

Reference metadata was not supplied for this record.