journal article·1998-10-01

Copper Deposition in the Presence of Polyethylene Glycol: I. Quartz Crystal Microbalance Study

James J. Kelly, Alan C. West

Publisher page

Abstract

The addition of polyethylene glycol (PEG) and to an acid copper electrolyte inhibits the deposition reaction for cathodic overpotentials of up to about 150 mV. Adding only promotes the deposition reaction, while adding PEG alone has a relatively small effect on electrode kinetics. Frequency shifts of an electrochemical quartz crystal microbalance suggest the adsorption of a monolayer of PEG molecules that are collapsed into spheres provided chloride ions are present, with little adsorption occurring when is absent. This behavior is the same for gold and copper surfaces. Transient current measurements suggest that chloride ions affect the PEG adsorption equilibrium rather than adsorption kinetics alone.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Corrosion Behavior and Inhibition · Electrodeposition and Electroless Coatings · Electrochemical Analysis and Applications

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Affiliations

Materials Science and Metallurgical Engineering, Columbia University, New York, New York 10027

Department of Chemical Engineering, Columbia University, New York, New York 10027

References

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