journal article·2025-10

Ultrasonic-assisted soldering of SiCp/Al metal matrix composites using Sn–Ag–Cu–Al solder at low temperatures

Guojing Xu, Xinran Ma, Wenkang Du, Pu Zhao, Yuanhang Xia, Zhengwei Li, Zhiwu Xu, Jiuchun Yan

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OpenAlex topics: Aluminum Alloys Composites Properties · Advanced Welding Techniques Analysis · Electronic Packaging and Soldering Technologies

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References (48)

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