journal article·2018-09

Irregular bending growth of free-standing Al microwire by electromigration

Yasuhiro Kimura

Acta Materialia· Volume 157
Publisher page

Abstract

Abstract Electromigration (EM) can generate free-standing micro- and nanowires that are occasionally irregularly bent to kinked and curved or collapsed shapes. The mechanism behind irregular bending was discussed based on electron microscopy data. Al microwires with the bamboo structure or single crystals were kinked at the grain boundaries (GBs) or at locations without GBs, respectively. Dislocation network and clusters of oxidation products were found in the wires. The kinking mechanism was attributed to the changing growth direction owing to GBs and the different growth rate of the outer circumference of the wire owing to the friction between the clusters and the TiN passivation. No buckling owing to gravity was observed. The high growth rate of Al microwires would be accompanied by low resistance in the discharge through a hole, which is attributed to the uniform friction along the periphery of the hole. In addition, the low wire diameter minimized the differences in growth rate. Hence, the increase in the growth rate of the wire by increasing the input current and substrate temperature and the decrease in the wire diameter favor wire straightness.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Metal and Thin Film Mechanics · Copper Interconnects and Reliability · Electronic Packaging and Soldering Technologies

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References (76)

Show source-provided references
1. Rapid and mass growth of stress-induced nanowhiskers on the surfaces of evaporated polycrystalline Cu films10.1016/j.scriptamat.2007.02.036 ↗
2. Fabrication of Cu nanowires at predetermined positions by utilising stress migration10.1111/j.1475-1305.2007.00370.x ↗
3. Growth of metal and metal oxide nanowires driven by the stress-induced migration10.1063/1.4718436 ↗
4. Spontaneous growth of metal whiskers on surfaces of solids: a review10.1016/j.jmst.2015.04.001 ↗
5. Light propagation in curved silver nanowire plasmonic waveguides10.1021/nl104514m ↗
6. Effects of uniaxial compressive strain on the electronic-transport properties of zigzag carbon nanotubes10.1007/s12274-016-1022-0 ↗
7. Controlled growth of ternary alloy nanowires using metalorganic chemical vapor deposition10.1021/nl080129n ↗
8. Elementary processes in nanowire growth10.1021/nl1027815 ↗
9. Chemical control of semiconductor nanowire kinking and superstructure10.1021/nl204065p ↗
10. Stability of microfabricated high aspect ratio structures in poly(dimethylsiloxane)10.1021/la046931w ↗
11. Control of Si nanowire growth by oxygen10.1021/nl060059p ↗
12. Controlling nanowire structures through real time growth studies10.1088/0034-4885/73/11/114501 ↗
13. Stability of high-aspect-ratio micropillar arrays against adhesive and capillary forces10.1021/ar100001a ↗
14. Reversible switching of InP nanowire growth direction by catalyst engineering10.1021/nl401767b ↗
15. Formation mechanisms for the dominant kinks with different angles in InP nanowires
16. Ultrasound-assisted recovery of free-standing high-aspect-ratio micropillars10.1039/C5RA26898B ↗
17. Electrodeposition and behavior of single metal nanowire probes10.1021/nn4066582 ↗
18. Thermal conduction in vertically aligned copper nanowire arrays and composites10.1021/acsami.5b05147 ↗
19. Aluminum nanowire arrays via directed assembly10.1021/acs.nanolett.5b02408 ↗
20. Stress-induced growth of aluminum nanowires with a range of cross-sections10.1002/pssa.201431618 ↗
21. Buried structure for increasing fabrication performance of micromaterial by electromigration10.7567/JJAP.55.06GH01 ↗
22. Fabrication of Al thin wire by utilizing controlled accumulation of atoms due to electromigration10.1016/j.matlet.2005.12.107 ↗
23. Forming microstructures by controlling the accumulation and discharge of Al atoms by electromigration10.1088/0022-3727/44/4/045501 ↗
24. Simplified processes using conductive passivation film for the fabrication of Al micro-wires by electromigration10.1016/j.matlet.2013.11.044 ↗
25. Mechanical properties of thin Al wires prepared by electromigration10.1143/JPSJ.81.094803 ↗
26. Tunable ultra-high aspect ratio nanorod architectures grown on porous substrate via electromigration10.1038/srep22272 ↗
27. Growth mechanisms of vapor-liquid-solid grown nanowires: a detailed analysis of irregular nanowire formation10.1016/j.jcrysgro.2013.12.042 ↗
28. Kinetically induced kinking of vapor-liquid-solid grown epitaxial Si nanowires10.1021/nl902013g ↗
29. Growth, defect formation, and morphology control of germanium–silicon semiconductor nanowire heterostructures10.1021/nl202126q ↗
30. Constraints on microcontact printing imposed by stamp deformation10.1021/la0113567 ↗
31. Mechanism of growth of whiskers on cadmium10.1063/1.1702147 ↗
32. Metal whiskers10.1063/1.1721508 ↗
33. “Spiral polygon” tin whiskers10.1063/1.1722177 ↗
34. Angular bends in whiskers10.1016/0001-6160(57)90001-9 ↗
35. Growth mechanism of proper tin-whisker10.1143/JJAP.8.1404 ↗
36. Growth and morphology of InBi whisker crystals10.1016/0022-0248(72)90084-X ↗
37. Whisker growth in Al thin films10.1016/0022-0248(76)90028-2 ↗
38. Observations on the growth of whisker crystals from zinc electroplate10.1007/BF02641971 ↗
39. Cleavage crystals of InBi10.1016/0167-577X(88)90122-X ↗
40. Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions10.1103/PhysRevB.49.2030 ↗
41. Whiskers grown on aluminum thin films during heat treatments10.1116/1.579983 ↗
42. Spontaneous growth mechanism of tin whiskers10.1016/S1359-6454(98)00045-7 ↗
43. Mechanism and prevention of spontaneous tin whisker growth10.2320/matertrans.46.2300 ↗
44. Theory of tin whisker growth: “The end game”, IEEE Trans. Electron. Packag
45. Mechanism of generation and growth of whiskers on tin electroplating10.2320/matertrans.MRA2008236 ↗
46. Spontaneous growth of whiskers on RE-bearing intermetallic compounds of Sn-RE, In-RE, and Pb-RE10.1016/j.jallcom.2009.07.012 ↗
47. Real-time SEM/FIB studies of whisker growth and surface modification
48. Effect of crystal orientation on kink formation on mechanically induced Sn whiskers
49. Morphology and growth kinetics of straight and kinked tin whiskers10.1007/s11661-012-1488-7 ↗
50. Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration10.1016/j.actamat.2012.12.019 ↗
51. Kato · 2016 · 1
52. Microtwinning in template-synthesized single-crystal metal nanowires10.1021/jp035068q ↗
53. Microstructure and growth mechanism of tin whiskers on RESn3 compounds10.1016/j.actamat.2012.09.080 ↗
54. Evaluation of fracture strength and interfacial strength of sputtered TiN and AlN films on titanium substrate10.2472/jsms.50.1335 ↗
55. Controlling electromigration to selectively form thin metal wires and metal microspheres10.1557/JMR.2008.0374 ↗
56. Severe plastic deformation (SPD) processes for metals10.1016/j.cirp.2008.09.005 ↗
57. An integrated theory of whisker formation: the physical metallurgy of whisker formation and the role of internal stresses10.1109/TEPM.2005.847443 ↗
58. Defect accumulation in pure fcc metals in the transient regime: a review10.1016/0022-3115(93)90125-I ↗
59. Surface damage formation during ion-beam thinning of samples for transmission electron microscopy10.1016/S0304-3991(00)00096-6 ↗
60. In situ site-specific specimen preparation for atom probe tomography10.1016/j.ultramic.2006.06.008 ↗
61. FIB-induced dislocations in Al submicron pillars: annihilation by thermal annealing and effects on deformation behavior10.1016/j.actamat.2016.03.017 ↗
62. Natural and thermally formed oxide films on aluminum10.1149/1.2430389 ↗
63. Vacuum brazing of aluminum alloy10.2464/jilm.48.439 ↗
64. Impedance characteristics of oxide layers on aluminium
65. Electromigration in thin aluminum films on titanium nitride10.1063/1.322842 ↗
66. Effect of an elastic substrate on buckling of free-standing nanocolumns, ZAMM Z10.1002/zamm.201300135 ↗
67. The development of γ-alumina in thermal oxide films on aluminum10.4139/sfj.40.788 ↗
68. Sn whisker growth during thermal cycling10.1016/j.actamat.2011.08.017 ↗
69. Suitable passivation thickness on a metal line to prevent electromigration damage10.1016/j.matlet.2016.08.059 ↗
70. NASA
71. Trial fabrication of Al micro-materials by electromigration using buildup structure
72. Fabrication of multiple Al micro-materials by electromigration using a comb pattern and a conductive passivation film10.4028/www.scientific.net/AMR.909.36 ↗
73. A new analysis of stress relaxation phenomena for stress-migration tolerance estimation
74. Thermal analysis of electromigration test structures10.1109/T-ED.1987.22978 ↗
75. Shackelford · 2001
76. Weast · 1987