Strengthening gold thin films with zirconia nanoparticles for MEMS electrical contacts

Abstract Thin gold films can be strengthened by the incorporation, during reactive sputtering, of nanosized dispersions of monoclinic zirconia. Micron-thick films containing ∼2 vol.% zirconia particles having a particle size of 1–3 nm are found to have an indentation hardness of 3.8 GPa after annealing for 60 h at 500 °C in air. Sputtered gold films of the same thickness and annealed under the same conditions had a hardness of 2.3 GPa. The nanoparticles of zirconia resist coarsening with no change in diameter between deposition and after 60 h at 500 °C. They also suppress grain growth of the gold grains. The electrical resistivity of the strengthened gold films was 4.5 μΩ cm, about 55% higher than gold films. The temperature coefficient of resistivity was unaffected.