journal article·2012-02

Surface topography and energy of grain boundary triple junctions in copper tricrystals

B. Zhao, A. Ziemons, L.S. Shvindlerman, G. Gottstein

Acta Materialia· Volume 60· Issue 3
Publisher page

Abstract

Abstract Copper tricrystals with a common crystallographic axis 〈1 0 0〉, 〈1 1 0〉, 〈1 1 1〉 were fabricated by the Bridgman technique. Utilizing atomic force microscopy, the topography of the grain boundary triple junctions for the three crystallographic systems were investigated. The grain boundary free surface energy and the grain boundary triple line energy were determined for specific crystallographies of tricrystals.
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Research context

OpenAlex topics: Copper Interconnects and Reliability · Microstructure and mechanical properties · nanoparticles nucleation surface interactions

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