Characterizing stable nanocrystalline Cu-Ta behavior and failure dynamics under extremes of strain rate, strain, temperature and pressure by modified dynamic tensile extrusion
Source abstract
Abstract
This work presents characterization of thermo-mechanically stable, bulk nanocrystalline (NC) Cu-Ta alloys under a combination of extreme states using high-temperature, dynamic tensile extrusion experiments. The NC Cu-Ta was subjected to high dynamic strain rates up to 10 5/s, large plastic strains of 100–500 %, and high homologous temperatures greater than 50 %T M . This combination of thermo-mechanical conditions provides a unique look at how these extremely stable microstructures can accommodate and reconfigure under situations where dislocation activity is the most extreme, given constitutive relationships between strain rate, dislocation nucleation, and plastic work. Elevated temperature tests results reveal NC Cu-1Ta alloys are capable of forming a coherent jet, (25 mm in length by 1.8 mm in diameter) as it accelerates out of the die after being dynamically extruded. Microstructural analysis reveals that unlike previous reports on conventional un-stabilized nano or near nano-grained Cu, NC Cu-Ta alloys behave differently. They do not undergo grain coarsening via a nucleation and growth process, but rather behave identically to that of coarse-grained Cu. The NC grains elongate along the extrusion direction and at the same time shrink in diameter and develop a <111> type texture. Ultimately, the occurrence of premature dynamic failure was attributed to the inherent constraints posed by processing defects during synthesis.
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Research context
OpenAlex topics: Microstructure and mechanical properties · Aluminum Alloys Composites Properties · Metallurgy and Material Forming
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (54)
Show source-provided references
1. Mechanical properties of nanocrystalline materials10.1016/j.pmatsci.2005.08.003 ↗
2. Bulk” nanocrystalline metals: review of the current state of the art and future opportunities for copper and copper alloys10.1007/s11837-014-0978-z ↗
3. The influence of time, temperature, and grain size on indentation creep in high-purity nanocrystalline and ultrafine grain copper10.1063/1.1828213 ↗
4. Rapid stress-driven grain coarsening in nanocrystalline Cu at ambient and cryogenic temperatures10.1063/1.2008377 ↗
5. Grain coarsening during compression of bulk nanocrystalline nickel and copper10.1016/j.scriptamat.2007.08.042 ↗
6. Stress-assisted discontinuous grain growth and its effect on the deformation behavior of nanocrystalline aluminum thin films10.1016/j.actamat.2006.01.023 ↗
7. Experimental observations of stress-driven grain boundary migration10.1126/science.1178226 ↗
8. Stress-driven grain growth in nanocrystalline Pt thin films10.1016/j.scriptamat.2010.08.057 ↗
9. Uniaxial tensile plastic deformation and grain growth of bulk nanocrystalline alloys10.1016/j.actamat.2006.06.016 ↗
10. Sliding wear of nanocrystalline Ni–W: structural evolution and the apparent breakdown of Archard scaling10.1016/j.actamat.2010.04.005 ↗
11. A review of fatigue behavior in nanocrystalline metals10.1007/s11340-009-9301-2 ↗
12. Nanoscale room temperature creep of nanocrystalline nickel pillars at low stresses10.1016/j.ijplas.2012.08.008 ↗
13. Nanocrystalline electrodeposited Ni: microstructure and tensile properties10.1016/S1359-6454(02)00198-2 ↗
14. Unusual stress and grain size dependence for creep in nanocrystalline materials10.1016/j.scriptamat.2009.03.009 ↗
15. Creep and superplasticity in nanocrystalline materials: current understanding and future prospects10.1016/S0928-4931(00)00190-9 ↗
16. Low temperature creep of nanocrystalline pure copper10.1016/S0921-5093(00)00633-X ↗
17. Creep behavior of nanocrystalline nickel at 290 and 373K10.1016/S0921-5093(00)01385-X ↗
18. New insight into the stable grain size of nanotwinned Ni in steady-state creep: effect of the ratio of effective-to-internal stress10.1016/j.ijplas.2016.07.009 ↗
19. Prolonged high-temperature exposure: tailoring nanocrystalline Cu–Ta alloys against grain growth10.1016/j.msea.2021.141818 ↗
20. Extreme creep resistance in a microstructurally stable nanocrystalline alloy10.1038/nature19313 ↗
21. An experimental and modeling investigation of tensile creep resistance of a stable nanocrystalline alloy10.1016/j.actamat.2020.08.020 ↗
22. Structure and thermal decomposition of a nanocrystalline mechanically alloyed supersaturated Cu–Ta solid solution10.1557/mrc.2015.34 ↗
23. Effect of Ta solute concentration on the microstructural evolution in immiscible Cu-Ta alloys10.1007/s11837-015-1643-x ↗
24. Thermo-mechanical strengthening mechanisms in a stable nanocrystalline binary alloy–A combined experimental and modeling study10.1016/j.matdes.2018.107551 ↗
25. Microstructural evolution in a nanocrystalline Cu-Ta alloy: a combined in-situ TEM and atomistic study10.1016/j.matdes.2016.10.020 ↗
26. The role of Ta on twinnability in nanocrystalline Cu–Ta alloys10.1080/21663831.2016.1201160 ↗
27. Stabilization and strengthening of nanocrystalline copper by alloying with tantalum10.1016/j.actamat.2012.01.011 ↗
28. Atomistic modeling of capillary-driven grain boundary motion in Cu-Ta alloys10.1016/j.actamat.2018.01.027 ↗
29. Stress-driven grain refinement in a microstructurally stable nanocrystalline binary alloy10.1016/j.scriptamat.2020.09.041 ↗
30. An insight into machining of thermally stable bulk nanocrystalline metals10.1002/adem.201800405 ↗
31. Nanotechnology enabled design of a structural material with extreme strength as well as thermal and electrical properties10.1016/j.mattod.2019.09.024 ↗
32. Anomalous mechanical behavior of nanocrystalline binary alloys under extreme conditions10.1038/s41467-018-05027-5 ↗
33. Strain-rate sensitivity of nanocrystalline Cu–10Ta to 700,000/s10.1007/s40870-019-00223-w ↗
34. Role of tantalum concentration, processing temperature, and strain-rate on the mechanical behavior of copper-tantalum alloys10.1016/j.actamat.2021.116706 ↗
35. Critical assessment of the extreme mechanical behavior of a stable nanocrystalline alloy under shock loading10.1016/j.actamat.2022.118105 ↗
36. Influence of shock prestraining and grain size on the dynamic-tensile-extrusion response of copper: experiments and simulation
37. Koby · 2019
38. Dynamic tensile extrusion behavior of coarse grained and ultrafine grained OFHC Cu10.1016/j.msea.2013.01.015 ↗
39. Analysis on dynamic tensile extrusion behavior of UFG OFHC Cu
40. Deformation and microstructural evolution of ultrafine-and fine-grained OFHC Cu during dynamic tensile extrusion10.1016/j.jmrt.2020.07.090 ↗
41. Microstructure and mechanical properties of bulk nanostructured Cu–Ta alloys consolidated by equal channel angular extrusion10.1016/j.actamat.2014.04.074 ↗
42. Revealing cryogenic mechanical behavior and mechanisms in a microstructurally-stable, immiscible nanocrystalline alloy10.1016/j.scriptamat.2018.09.035 ↗
43. Modelling and simulation of dynamic recrystallization (DRX) in OFHC copper at very high strain rates10.1063/1.4971659 ↗
44. Deformation and texture evolution of OFHC copper during dynamic tensile extrusion10.1016/j.actamat.2015.01.053 ↗
45. Dynamic recrystallization during high-strain-rate tension of copper10.1007/s11661-016-3491-x ↗
46. Dynamic tensile extrusion behavior of fine-grained copper fabricated by powder injection molding10.3390/cryst12020147 ↗
47. A review of dynamic recrystallization phenomena in metallic materials10.1016/j.matdes.2016.09.012 ↗
48. Microstructural evolution in Al deformed to strains of 60 at 400 C10.1016/0036-9748(85)90268-6 ↗
49. Evolution of flow stress in aluminium during ultra-high straining at elevated temperatures. Part II10.1080/01418618908213873 ↗
50. New developments in geometric dynamic recrystallization10.1016/j.msea.2005.08.052 ↗
51. An experimental study of the recrystallization mechanism during hot deformation of aluminium10.1016/S0921-5093(00)00733-4 ↗
52. Theoretical predictions and experimental verification of surface grain structure evolution for AA6061 during hot rolling10.1016/j.actamat.2008.08.050 ↗
53. The problem of intermixing of metals possessing no mutual solubility upon explosion welding (Cu–Ta, Fe–Ag, Al–Ta)10.1016/j.matchar.2012.10.011 ↗
54. Structure and microhardness of Cu-Ta joints produced by explosive welding10.1155/2013/256758 ↗