Abrasive properties of nano silica particles prepared by a sol–gel method for polishing silicon wafers
Source abstract
Abstract
Abrasive properties of cocoon shaped silica particles fabricated by a sol–gel method have been studied. Since silicon wafers are polished with slurry by the mechanism of Chemical Mechanical Polishing, polishing rates may depend on various chemical and mechanical factors, such as particle concentration in slurry, slurry pH and kinds of basic compounds for controlling the slurry pH.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Advanced Surface Polishing Techniques · Diamond and Carbon-based Materials Research · Laser Material Processing Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (11)
Show source-provided references
1. Stöber W, Fink A, Bohn E (1968) J Colloid Interf Sci 26:6210.1016/0021-9797(68)90272-5 ↗
2. Arai Y, Segawa H, Yoshida K (2004) J Sol–Gel Sci Technol 32:7910.1007/s10971-004-5769-5 ↗
3. Chuhong Zhou, Lei Shan, Hight JR, Danyluk S, Ng SH, Paszkowski AW (2002) J Soc Tribol Lubr Eng, August 2002:35
4. Brown NJ, Baker PC, Maney RT (1981) Proc SPIE 306:4210.1117/12.932717 ↗
5. Cook LM (1990) J Non-Cryst Solids 120:15210.1016/0022-3093(90)90200-6 ↗
6. Jairath R, Desai M, Stell M, Tolles R, Scherber-Brewer D (1994) Mat Res Soc Symp Proc 337:12110.1557/PROC-337-121 ↗
7. Mahajan U, Bielmann M, Singh RK (1999) Mat Res Soc Symp Proc: -Chemical-Mechanical Polishing- Fundamentals and Challenges 566:2710.1557/PROC-566-27 ↗
8. Izumitani T (1984) Tech. Digest, Topical Meeting on the Science of Polishing, Paper TuB-A1, Optical Society of America10.1364/SOP.1984.TuBA1 ↗
9. Alexander GB, Heston WM, Iler RK (1954) J Phys Chem 58:45310.1021/j150516a002 ↗
10. Iler RK (1979) The chemistry of silica. J. Willey and sons, New York
11. Mahajan U, Bielmann M, Singh RK (1999) Electrochem Solid-State Lett 2:8010.1149/1.1390741 ↗