journal article·2016-03

Selection of the first Ni silicide phase by controlling the Pt incorporation in the intermixed layer

Mike El Kousseifi, Khalid Hoummada, Maxime Bertoglio, Dominique Mangelinck

Acta Materialia· Volume 106
Publisher page

Abstract

Abstract During the deposition of a Ni film on a Si substrate, an intermixed layer usually forms at the Ni/Si interface. In this work, the influence of Pt incorporation in this intermixed layer on the phase formation sequence and especially on the first phase formation is studied by in situ-XRD measurements and atom probe tomography (APT). Four different samples were elaborated where the intermixed layer was modified by deposition of a 3 nm of Ni or Ni(10 at% Pt) on the Si substrate prior to the deposition of Ni(10 at%Pt) or Ni film respectively. These results show that the formation of the first phase changes between δ-Ni2Si and θ-Ni2Si depending on the Pt concentration integrated in the intermixed layer. Using this selection method to control the formation of the first phase, can impact the self-aligned silicide process used by the industry.
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Research context

OpenAlex topics: Semiconductor materials and interfaces · Advanced Materials Characterization Techniques · Integrated Circuits and Semiconductor Failure Analysis

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