Selected-area growth of nickel micropillars on aluminum thin films by electroless plating for applications in microbolometers
Source abstract
Abstract
An optimization process of electroless plating of nickel was carried out with NiCl 2 as the nickel ion source, NaH 2 PO 2 as the reduction agent, CH 3 COONa and Na 3 C 6 H 5 O 7 as complexing agents. Electroless plated nickel layers on sputtered aluminum corning glass substrates with a resistivity of about 75.9 μΩ cm and a nickel concentration higher than 93% were obtained. This optimum process was successfully applied in growing nickel micropillars at selected areas with a well-controlled height. The microstructure of the masking layers was fabricated by means of optical photolithography for subsequent growth of nickel micropillars on selected areas. Micropillars size was defined by the opening size and the height was controlled by adjusting the plating time at a growth rate of 0.41 μm/min. This result shows that electroless nickel plating could be a good candidate for growing micropillars for applications in microbolometers.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Thermoelectric Materials and Devices · Transition Metal Oxide Nanomaterials · Advanced Sensor and Energy Harvesting Materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (28)
Show source-provided references
1. Integrating MEMS and ICs10.1038/micronano.2015.5 ↗
2. IR detection with uncooled focal plane arrays, state-of-the art and trends
3. MEMS-based uncooled infrared bolometer arrays: a review10.1117/12.755128 ↗
4. Fabrication and performance of microbolometer arrays based on nanostructured vanadium oxide thin films10.1088/0964-1726/16/3/016 ↗
5. Easy to use uncooled ¼ VGA 17 μm FPA development for high performance compact and low-power systems
6. A monolithic resonant terahertz sensor element comprising a metamaterial absorber and micro-bolometer10.1002/lpor.201300087 ↗
7. Antenna-coupled microbolometer array for terahertz detection
8. Microbolometer terahertz focal plane array and camera with improved sensitivity in the sub-terahertz region10.1007/s10762-015-0184-2 ↗
9. Schlesinger · 2010
10. Mallory · 1990
11. Copper on-chip interconnections, a breakthrough in electrodeposition to make better chips10.1149/2.F06991IF ↗
12. Channel-constrained electroless metal deposition on ligating self-assembled film surfaces10.1149/1.1391780 ↗
13. Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)10.1016/0167-9317(86)90004-3 ↗
14. Microspectrometer fabricated by the liga process10.1179/isr.1993.18.3.273 ↗
15. Under bump metallisation of fine pitch flip-chip using electroless nickel deposition
16. Electroless nickel bumping of aluminum bondpads - Part I: surface pretreatment and activation10.1109/6144.991180 ↗
17. Fabrication technology of CMOS-MEMS probe chip compatible with electroless nickel plating process
18. Laser-assisted electroless Ni-P deposition at selected areas on Al(-Mg, Si, Cu) alloys10.1149/1.1393504 ↗
19. The role of iron(III) and tartrate in the zincate immersion process for plating aluminium10.1023/A:1018468627773 ↗
20. Double zincate pretreatment of sputter-deposited Al films10.1149/1.1370966 ↗
21. The electroless nickel plating bath: effect of variables on the process
22. The plating rates and physical properties of electroless nickel/phosphorus alloy deposits10.1080/00202967.1968.11870052 ↗
23. Electroless deposition of nickel
24. Efficient electroless nickel plating from highly active Ni–B nanoparticles for electric circuit patterns on Al2O3 ceramics10.1039/c3tc31048e ↗
25. Effects of sodium citrate concentration on electroless Ni-Fe bath stability and deposition10.1007/s11664-013-2838-y ↗
26. Influence of sodium acetate on electroless Ni-P deposits and effect of heat treatment on corrosion behavior
27. Study of optimized complexing agent for low-phosphorus electroless nickel plating bath10.1149/1.2001487 ↗
28. Effect of surfactants on performance of electroless plating baths for nickel–ceramic composite membrane fabrication10.1179/1743294411Y.0000000035 ↗