A unified kinetic model for stress relaxation and recovery during and after growth interruptions in polycrystalline thin films
Source abstract
Abstract
Abstract A model for the kinetics of residual stress evolution is described that can be applied to both the relaxation during a growth interruption and the recovery following resumption of growth. The stress is attributed to simple atomistic processes based on reversible diffusion of atoms in and out of the grain boundary. Each of these processes is considered separately to understand how the rates differ during relaxation and recovery and how they depend on grain size, film thickness, temperature, deposition rate, and initial stress. The model is compared with experimental data obtained by others for several materials (Fe, Ni and Au).
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Metal and Thin Film Mechanics · Copper Interconnects and Reliability · Semiconductor materials and devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (37)
Show source-provided references
1. Residual stress in Ni–W electrodeposits10.1016/j.electacta.2005.11.053 ↗
2. Application of Ni electroplating techniques towards stress-free microelectromechanical system-based sensors and actuators10.1243/0954406JMES231 ↗
3. Origin of compressive residual stress in polycrystalline thin films10.1103/PhysRevLett.88.156103 ↗
4. Weak temperature dependence of stress relaxation in as-deposited polycrystalline gold films
5. The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films10.1063/1.1352563 ↗
6. Reversible stress changes at all stages of Volmer–Weber film growth10.1063/1.1637728 ↗
7. Compressive stress in polycrystalline Volmer-Weber films10.1103/PhysRevLett.94.146101 ↗
8. Direct evidence for effects of grain structure on reversible compressive deposition stresses in polycrystalline gold films10.1103/PhysRevLett.102.256101 ↗
9. Reversible stress changes at all stages of Volmer–Weber film growth10.1063/1.1637728 ↗
10. The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films10.1063/1.1352563 ↗
11. Kinetics and magnitude of the reversible stress evolution during polycrystalline film growth interruptions10.1063/1.4928162 ↗
12. Fast and slow stress evolution mechanisms during interruptions of Volmer-Weber growth10.1063/1.4863600 ↗
13. Intrinsic compressive stress in polycrystalline films is localized at edges of the grain boundaries10.1103/PhysRevLett.119.256102 ↗
14. Disclosing the origin of the postcoalescence compressive stress in polycrystalline films by nanoscale stress mapping10.1103/PhysRevB.98.195428 ↗
15. Weak temperature dependence of stress relaxation in as-deposited polycrystalline gold films10.1103/PhysRevB.82.121402 ↗
16. The intrinsic stress of polycrystalline and epitaxial thin metal films10.1088/0953-8984/6/45/005 ↗
17. Measurements of the intrinsic stress in thin metal films10.1016/0042-207X(90)93933-A ↗
18. Interfaces and stresses in thin films10.1016/S1359-6454(99)00286-4 ↗
19. Guduru, Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models10.1063/1.4949263 ↗
20. Stresses in thin films: The relevance of grain boundaries and impurities10.1016/0040-6090(76)90453-3 ↗
21. Stress distributions and thin film mechanical properties10.1002/sia.740030113 ↗
22. Comment on “Compressive Stress in Polycrystalline Volmer-Weber Films”10.1103/PhysRevLett.95.229601 ↗
23. Das Reply10.1103/PhysRevLett.95.229602 ↗
24. Stress in thin films and coatings: Current status, challenges, and prospects10.1116/1.5011790 ↗
25. Compressive stress generation in Sn thin films and the role of grain boundary diffusion10.1103/PhysRevLett.103.056102 ↗
26. A kinetic analysis of residual stress evolution in polycrystalline thin films10.1016/j.tsf.2012.11.001 ↗
27. Kinetic model for thin film stress including the effect of grain growth10.1063/1.5030740 ↗
28. Kinetic model for dependence of thin film stress on growth rate, temperature, and microstructure10.1063/1.4704683 ↗
29. Hang Yu, Mechanism for intrinsic stress evolution during and after polycrystalline thin film growth, Ph.D thesis, Massachusetts Institute of Technology, 2013.
30. Grain growth and complex stress evolution during Volmer–Weber growth of polycrystalline thin films10.1016/j.actamat.2013.12.031 ↗
31. Diffusion in nanocrystalline nickel10.1016/0965-9773(95)00198-0 ↗
32. Influence of phosphorus in dilute solid solution on the absolute surface and grain boundary energies iron
33. Determination of the interfacial tension by zero creep experiments on multilayers—I. Theory10.1016/0956-7151(93)90115-9 ↗
34. Determination of the interfacial tension by zero creep experiments on multilayers—II. Experiment10.1016/0956-7151(93)90116-A ↗
35. Chemical potentials driving diffusional flow in multilayers10.4028/www.scientific.net/MSF.154.43 ↗
36. Reversible stress relaxation during precoalescence interruptions of Volmer-Weber thin film growth10.1103/PhysRevLett.89.126103 ↗
37. Correlation of shape changes of grain surfaces and reversible stress evolution during interruptions of polycrystalline film growth10.1063/1.4871214 ↗