journal article·2010-03

Wood-Polyvinyl Chloride Composite for Insulation of Electrical Wires: Fabrication and Investigation of Properties

Mohammad Hasan Moeini, S. Hamid Heidary, Iraj Amiri, Arash Payami

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Abstract

In this study, five series of wood—polyvinyl chloride composite samples were prepared by granules production followed by extrusion process for insulation of cuprous wires. The effects of wood flour content and its size on thermal stability, physical, mechanical, and electrical properties of these composites were investigated. The obtained results show that the density as well as the mechanical properties decreases, as the wood flour content increases. Also, wood flour composites with smaller particles have better mechanical properties and lower density. Thermal decomposition of these composites was investigated by thermogravimetric analysis (TGA). In general, thermal decomposition of polyvinyl chloride is inhibited by the addition of wood flour to the polyvinyl chloride compound. Moreover, electrical tests showed high amounts of wood flour can’t be used when high volume resistivity is necessary.
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Research context

OpenAlex topics: Natural Fiber Reinforced Composites · Flame retardant materials and properties · Advanced Cellulose Research Studies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Composite Research Center, Malek Ashtar University of Technology, Lavizan, Tehran 16788, Iran

Composite Research Center, Malek Ashtar University of Technology, Lavizan, Tehran 16788, Iran,

References (19)

Show source-provided references
1. 10.1016/j.compscitech.2006.06.01910.1016/j.compscitech.2006.06.019 ↗
2. Bledzki, A.K. · Polym. Sci. · 1999 · 24 · 221
3. 10.1016/j.compscitech.2006.06.02110.1016/j.compscitech.2006.06.021 ↗
4. 10.1016/j.compositesa.2003.09.01610.1016/j.compositesa.2003.09.016 ↗
5. 10.1023/A:102101392191610.1023/A:1021013921916 ↗
6. 10.1177/00307270950240020410.1177/003072709502400204 ↗
7. 10.1016/S0266-3538(00)00168-810.1016/S0266-3538(00)00168-8 ↗
8. 10.1016/j.compscitech.2006.07.03110.1016/j.compscitech.2006.07.031 ↗
9. 10.1016/j.compscitech.2006.11.00910.1016/j.compscitech.2006.11.009 ↗
10. 10.1016/j.polymdegradstab.2005.02.02010.1016/j.polymdegradstab.2005.02.020 ↗
11. Madison, W.
12. 10.1002/978047016593510.1002/9780470165935 ↗
13. 10.1002/app.2064410.1002/app.20644 ↗
14. 10.1016/0960-8524(91)90122-Z10.1016/0960-8524(91)90122-Z ↗
15. Bankian, M. · 2003
16. Beall, F.C. · 2002
17. Gächter, R. · 1984
18. 10.1002/pi.153510.1002/pi.1535 ↗
19. Parsapajouh, D. · 1994