Analysis of Physical and Solvent Transport Behavior of Poly(Ethylene-co-Vinyl Acetate)/Silica Composites

This article deals with the effect of nano silica on the cure, mechanical, solvent transport, dielectric, and thermal behavior of poly(ethylene-co-vinyl acetate) (EVA). X-ray diffraction is used to analyze the composite morphology. The cure time and scorch time of the composite was found to be decreasing with filler content. The mechanical properties of the composites such as tensile strength, hardness, and abrasion resistance increased with filler incorporation. The mechanical properties of the composites have been compared with some of the other EVA composites. The solvent resistance of the composite has also been tremendously improved with filler loading. The overall thermal stability of the composite has been found to be improved with filler loading.