Antithermal mobility in Σ7 and Σ9 grain boundaries caused by stick-slip stagnation of ordered atomic motions about Coincidence Site Lattice atoms

Abstract Antithermal grain boundary migration is an interesting phenomenon that has been recently discovered. These grain boundaries behave opposite to what is expected of thermally activated grain boundary migration; the antithermal grain boundaries exhibit mobility that decreases with increasing temperature. Two recent studies have provided insight into important behaviors correlated with antithermal migration. O'Brien and Foiles (J Mater. Sci. Vol. 51, p. 6607–6623, 2016) demonstrated that the high mobility exhibited by an antithermal Σ7 grain boundary is enabled by ordered atomic motions. Ulomek and Mohles (Acta Mater. Vol. 103, p. 424–432, 2016) demonstrated that the thermal migration of a different Σ7 grain boundary exhibited a two-step migration process. In this work, we demonstrate that the antithermal temperature dependence exhibited by these types of grain boundaries is caused by a combination of these two discoveries. Specifically, ordered atomic motions about Coincidence Site Lattice atoms (atoms common to the lattices on either side of the grain boundary), seen by O'Brien and Foiles, are interrupted by additional thermal energy at higher temperature. This is the source of the two-step process seen by Ulomek and Mohles. This two-step process is akin to stick-slip behaviors observed in shear coupled grain boundary migration. As temperature is increased, the duration of the stagnant portion increases and the mobility decreases. This behavior is demonstrated through molecular dynamics simulations in nickel bicrystals over temperatures ranging from 100 to 1400 K for Σ7 and Σ9 grain boundaries. For these Σ7 and Σ9 grain boundaries, those that have ordered atomic mechanisms are almost exclusively antithermal, while those that do not have ordered atomic mechanisms are thermally activated.