Mechanical and Thermal Properties of Polymer Composites for Electronic Packaging Application

Erfan Suryani Abdul Rashid; Kamarshah Ariffin; Hazizan Md Akil; Chee Choong Kooi

doi:10.1177/0731684407086328

journal article·2008-10

Mechanical and Thermal Properties of Polymer Composites for Electronic Packaging Application

Erfan Suryani Abdul Rashid, Kamarshah Ariffin, Hazizan Md Akil, Chee Choong Kooi

Journal of Reinforced Plastics and Composites· Volume 27· Issue 15

Publisher page

Source abstract

Abstract

Alumina (AE) and mica (ME) particles were used as fillers in epoxy-based polymer composites. Comparisons were made between the composites with respect to mechanical, thermal, and morphological properties. Mechanical and thermal studies were performed on the composites at various filler contents. Dispersion of the filler was evaluated using scanning electron micrograph (SEM). It was found that the flexural modulus of the composites was almost identical as far as AE and ME are concerned, particularly at 025 vol% of filler content. However, obvious increment was observed in the case of AE for flexural strength.

Source: crossref · Quality: baseline

Research context

Polymers Composites

OpenAlex topics: Mechanical Behavior of Composites · Epoxy Resin Curing Processes · Electronic Packaging and Soldering Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia 14300 Seberang Perai Selatan, Pulau Pinang, Malaysia

School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia 14300 Seberang Perai Selatan, Pulau Pinang, Malaysia,

Intel Technology Sdn. Bhd, Pg9, Bayan Lepas Industrial Zone, Phase 3 Halaman Kampung Jawa, 11900 Penang

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