Chemical ordering and texture in Ni–25 at% Al thin films

Abstract This paper describes a novel study of the microstructural development in sputter-deposited thin films from a target of the intermetallic compound Ni3Al. Films were deposited on oxidized Si substrates at different temperatures, namely 45°C, 200°C, and 400°C. These films have been characterized by X-ray diffraction and transmission electron microscopy. In contrast to the behavior of sputter-deposited elemental metals and disordered alloys, the films deposited at the two higher temperatures consisted of refined microstructures and exhibited a low degree of texturing. This anomalous behavior has been explained by the role of exothermic heating accompanying chemical ordering.