journal article·1999-04

Simulation of the influence of particles on grain structure evolution in two-dimensional systems and thin films

S.P. Riege, C.V. Thompson, H.J. Frost

Acta Materialia· Volume 47· Issue 6
Publisher page

Abstract

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Research context

OpenAlex topics: Copper Interconnects and Reliability · Microstructure and mechanical properties · Metal and Thin Film Mechanics

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