Interface flow mechanism for tin whisker growth
Source abstract
Abstract
Abstract Tin coatings, widely used in electronics, are susceptible to the spontaneous eruption of fine metal filaments or “whiskers”. Tin whiskers are a serious reliability issue in microelectronics, as they can cause short circuits and device failure. While it is generally accepted that whiskers grow to relieve compressive stresses, the specific mechanism for whisker formation is yet unknown. Data are presented to support an interface-transport mechanism for whisker nucleation and growth. This mechanism, involving the formation of a viscous layer at the interface between substrate and coating, could explain the extremely rapid growth of whiskers that has been observed experimentally.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability · Semiconductor materials and devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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