Diffusional back flows during electromigration
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Research context
OpenAlex topics: Copper Interconnects and Reliability · Metal and Thin Film Mechanics · Electronic Packaging and Soldering Technologies
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References (10)
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6. Blech · Thin Solid Films · 1975 · 25 · 32710.1016/0040-6090(75)90052-8 ↗
7. Herring, C., in Structure and Properties of Solid Surfaces, ed. R. Gomer and C. S. Smith. University of Chicago Press, 1953, p. 5
8. Herring · Scripta metall. · 1971 · 5 · 27310.1016/0036-9748(71)90193-1 ↗
9. Ross · J. Appl. Phys. · 1989 · 66 · 234910.1063/1.344266 ↗
10. Hu · Appl. Phys. Lett. · 1993 · 62 · 102310.1063/1.108513 ↗