In situ epitaxial thickening of wafer-scale, highly oriented nanotwinned Ag on tailored polycrystalline Cu substrates
Source abstract
Abstract
Highly (111)-oriented nanotwinned Ag (nt-Ag) is a promising candidate for a next-generation direct metal bonding material without a vacuum environment. However, conventional methods used for its preparation are costly, complex, and inefficient. Herein, we report an in-situ epitaxial thickening approach of wafer-scale (111) nt-Ag on tailored polycrystalline Cu substrates via a galvanic replacement reaction (GRR). The resultant Ag films replicate the crystallographic structure of the Cu substrate and exhibit local single crystallinity, which effectively protects the substrate from oxidation and achieves better bonding quality. Through detailed structural characterization and theoretical calculations, we provide insights on the counterintuitive thickening-corrosion mechanisms of GRR for the first time. We find that the interfacial interaction within the Ag/Cu becomes an additional driving force for the Ag ions to enter the lattice when the Cu substrate corrosion is inhibited. Our findings provide valuable insights into the formation and growth of nanotwin structures and can advance the future practical application of (111) nt-Ag in the microelectronics industry.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Copper Interconnects and Reliability · Nanomaterials and Printing Technologies · ZnO doping and properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (79)
Show source-provided references
1. Moore's law: the journey ahead10.1126/science.ade2191 ↗
2. Low temperature interfacial reaction in 3D IC nanoscale materials10.1016/j.mser.2022.100701 ↗
3. Development of low temperature CuCu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)10.1016/j.microrel.2021.114412 ↗
4. Single-crystal-like Cu joints with high strength and resistance to fatigue failures10.1016/j.msea.2022.144051 ↗
5. Wafer-level Cu–Cu bonding technology10.1016/j.microrel.2011.04.016 ↗
6. Characteristics of copper nitride nanolayer used in 3D Cu bonding interconnects10.1007/s13391-021-00299-4 ↗
7. Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement10.1016/j.microrel.2011.04.003 ↗
8. Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient10.1038/s41598-018-32280-x ↗
9. Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu10.1038/srep09734 ↗
10. Electrodeposition of nano-twinned Cu and their applications in electronics10.1149/1945-7111/ac9e20 ↗
11. Effect of nanotwin boundary on the Cu–Cu Bonding10.1149/2162-8777/ac0e14 ↗
12. Atomic-scale investigation of electromigration with different directions of electron flow into high-density nanotwinned copper through in situ HRTEM10.1016/j.actamat.2021.117250 ↗
13. Mechanical strengthening of nanotwinned Cu films with Ag solid solution10.1016/j.matlet.2022.131775 ↗
14. Low temperature Ag-Ag direct bonding technology for advanced chip-package interconnection
15. Low temperature Ag-Ag direct bonding under air atmosphere10.1016/j.jallcom.2020.158587 ↗
16. Direct metal bonding using nanotwinned Ag films with (111) surface orientation under air atmosphere for heterogeneous integration10.1016/j.apsusc.2021.151845 ↗
17. Improvement of Ag films with highly (111) surface orientation for metal direct bonding technique: nanotwinned structure and ion bombardment effect10.1016/j.matchemphys.2021.125159 ↗
18. Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias10.1016/j.mtla.2021.101215 ↗
19. Lattice buffer effect of Ti film on the epitaxial growth of Ag nanotwins on Si substrates with various orientations10.1016/j.matchar.2020.110509 ↗
20. Characterization of interfacial structure for low-temperature direct bonding of Si substrates sputtered with Ag nanotwinned films10.1016/j.matchar.2021.111060 ↗
21. Direct observation of the nanoscale Kirkendall effect during galvanic replacement reactions10.1038/s41467-017-01175-2 ↗
22. Large-area vertically aligned bismuthene nanosheet arrays from galvanic replacement reaction for efficient electrochemical CO2 conversion10.1002/adma.202100910 ↗
23. 25th anniversary article: galvanic replacement: a simple and versatile route to hollow nanostructures with tunable and well-controlled properties10.1002/adma.201302820 ↗
24. New precision electroforming process for the simultaneous improvement of thickness uniformity and microstructure homogeneity of wafer-scale nanotwinned copper arrays10.1016/j.ijmachtools.2023.104006 ↗
25. Controllable crystallographic texture in copper foils exhibiting enhanced mechanical and electrical properties by pulse reverse electrodeposition10.1021/acs.cgd.5b00748 ↗
26. Microstructure and mechanical properties of copper microtubes fabricated via the electroforming process10.1007/s11665-020-04691-3 ↗
27. Preparation of highly (111) textured nanotwinned copper by medium-frequency pulsed electrodeposition in an additive-free electrolyte10.1016/j.electacta.2020.137391 ↗
28. Crystallographic tool box (CrysTBox): automated tools for transmission electron microscopists and crystallographers10.1107/S1600576715017252 ↗
29. Analysis tools for electron and X-ray diffraction, atex - software, université de lorraine
30. From ultrasoft pseudopotentials to the projector augmented-wave method10.1103/PhysRevB.59.1758 ↗
31. Generalized gradient approximation made simple10.1103/PhysRevLett.77.3865 ↗
32. Growth mechanisms of Ag and Cu nanodendrites via galvanic replacement reactions10.1016/j.pnsc.2020.12.007 ↗
33. Metallization and nanostructuring of semiconductor surfaces by galvanic displacement processes10.1016/j.surfrep.2007.08.002 ↗
34. Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface10.1038/s41467-017-02154-3 ↗
35. The effect of nanotwins on the corrosion behavior of copper10.1016/j.actamat.2013.12.030 ↗
36. Twin-interface interactions in nanostructured Cu/Ag: molecular dynamics study10.1016/j.actamat.2017.10.036 ↗
37. Interface structure and energy in Cu–71.8wt.% Ag10.1016/j.jallcom.2007.10.015 ↗
38. Twin-mediated epitaxial growth of highly lattice-mismatched Cu/Ag core–shell nanowires10.1039/C8NR02875C ↗
39. Shearing characteristics of Cu-Cu joints fabricated by two-step process using highly <111>-oriented nanotwinned Cu10.3390/met11111864 ↗
40. Reactive wafer bonding with nanoscale Ag/Cu multilayers10.1016/j.scriptamat.2020.03.043 ↗
41. Influence of nanoparticles content in silver paste on mechanical and electrical properties of LTJT joints10.1016/j.apt.2015.03.007 ↗
42. Epitaxial growth of (111) nanotwinned Ag on (111) nanotwinned Cu films for low-temperature Cu–Cu bonding10.1021/acs.cgd.3c00157 ↗
43. High performance metallic joints from screen-printed Cu@Ag nanopastes10.1016/j.mtla.2020.100871 ↗
44. The effect of an Ag nanofilm on low-temperature Cu/Ag-Ag/Cu chip bonding in air10.3390/app11209444 ↗
45. Investigation of low-temperature Cu–Cu direct bonding with Pt passivation layer in 3-D Integration10.1109/TCPMT.2021.3069085 ↗
46. Development of nanotwins in electroplated copper and its effect on shear strength of tin/copper joint10.1016/j.jallcom.2018.06.247 ↗
47. Development of anti-oxidation Ag salt paste for large-area (35 × 35 mm2) Cu-Cu bonding with ultra-high bonding strength10.1016/j.jmst.2021.08.095 ↗
48. Characterization of Cu-Cu direct bonding in ambient atmosphere enabled using (111)-oriented nanotwinned-copper10.1016/j.matchemphys.2023.128089 ↗
49. Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding10.1016/j.jtice.2021.10.027 ↗
50. Correlation between the microstructures of bonding interfaces and the shear strength of Cu-to-Cu joints using (111)-oriented and nanotwinned Cu10.3390/ma11122368 ↗
51. Low temperature and pressureless Cu-to-Cu direct bonding by green synthesized Cu nanoparticles10.1016/j.jtice.2021.06.026 ↗
52. Brass bonding using copper nanoparticles and zinc powder for packaging of power electronic devices10.1016/j.jallcom.2019.02.249 ↗
53. Low-temperature (70°C) Cu-to-Cu direct bonding by capping metal layers10.1109/LED.2021.3105434 ↗
54. Watanabe · 2004
55. Nearly single-crystalline GaN light-emitting diodes on amorphous glass substrates10.1038/nphoton.2011.253 ↗
56. Internal quantum efficiency higher than 100% achieved by combining doping and quantum effects for photocatalytic overall water splitting10.1038/s41560-023-01242-7 ↗
57. Deposition of hermetic silver shells onto copper flakes10.1016/j.jcis.2016.10.087 ↗
58. Heteroepitaxial growth of gold nanostructures on silicon by galvanic displacement10.1021/nn900685a ↗
59. Stronger and more failure-resistant with three-dimensional serrated bimetal interfaces10.1016/j.actamat.2018.12.051 ↗
60. Effects of reference materials on texture coefficients determined for a CVD α-Al2O3 coating10.1016/j.surfcoat.2018.12.095 ↗
61. Growth, interfacial microstructure and optical properties of NiO thin films with various types of texture10.1016/j.actamat.2018.11.018 ↗
62. Achieving ultrahigh-rate planar and dendrite-free zinc electroplating for aqueous zinc battery anodes10.1002/adma.202202552 ↗
63. High strength, epitaxial nanotwinned Ag films10.1016/j.actamat.2010.09.011 ↗
64. Nanotwinned silver nanowires: structure and mechanical properties10.1016/j.actamat.2015.02.041 ↗
65. Enhanced hardening in Cu/330 stainless steel multilayers by nanoscale twinning10.1016/j.actamat.2003.10.033 ↗
66. Direct electrosynthesis of 52% concentrated CO on silver's twin boundary10.1038/s41467-021-22428-1 ↗
67. Modulation of crystallographic texture and twinning structure of Cu nanowires by electrodeposition10.1149/2.046306jes ↗
68. Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper10.1126/science.1216511 ↗
69. Influence of grain boundary characteristics on thermal stability in nanotwinned copper10.1038/srep31410 ↗
70. Twin lamellae as possible self-perpetuating step sources10.1016/0022-0248(88)90339-9 ↗
71. Orientation-controlled nanotwinned copper prepared by electrodeposition10.1016/j.electacta.2015.08.022 ↗
72. A kinetic model of copper-to-copper direct bonding under thermal compression10.1016/j.jmrt.2021.09.071 ↗
73. Predicting trends in rate parameters for self-diffusion on FCC metal surfaces10.1016/S0039-6028(02)01916-7 ↗
74. Impact of contact integrity during thermal stress testing on degradation analysis of copper-plated silicon solar cells10.1016/j.solmat.2017.09.005 ↗
75. Electrical and reliability investigation of Cu-to-Cu bonding with silver passivation layer in 3D Integration10.1109/TCPMT.2020.3037365 ↗
76. Galvanic corrosion of lithium-powder-based electrodes
77. Grain-size-dependent ductile-to-brittle fracture mechanism of titanium sheets10.1016/j.scriptamat.2022.114877 ↗
78. Effect of fracture properties and surface morphology on wear of DLC coatings at severe contact condition10.1016/j.triboint.2022.107486 ↗
79. The role of “thickness effect” on the damage progression and crack growth inside the plain-woven carbon fiber composites10.1016/j.compscitech.2023.110108 ↗